Chang-Sheng Chen

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including die interposed between cup-shaped l...
- Patent number 7,394,150
- Issue date Jul 1, 2008
- Siliconix Incorporated
- Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package including die interpose...
- Patent number 7,238,551
- Issue date Jul 3, 2007
- Siliconix Incorporated
- Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical structure for semiconductor wafer-level chip scale packages
- Patent number 6,392,290
- Issue date May 21, 2002
- Siliconix Incorporated
- Y. Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package including die interposed between cup-shaped l...
- Publication number 20060108671
- Publication date May 25, 2006
- Siliconix Incorporated
- Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating semiconductor package including die interpose...
- Publication number 20060110856
- Publication date May 25, 2006
- Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS