Changhua LIU

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Device, method and system for optical communication with a waveguid...
- Patent number 12,164,147
- Issue date Dec 10, 2024
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Grant
Substrate with variable height conductive and dielectric elements
- Patent number 11,837,534
- Issue date Dec 5, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to achieve tilted patterning with a through resist thickness...
- Patent number 11,644,757
- Issue date May 9, 2023
- Intel Corporation
- Changhua Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method to achieve tilted patterning with a through resist thickness
- Patent number 11,586,112
- Issue date Feb 21, 2023
- Intel Corporation
- Changhua Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prism-mask for angled patterning applications
- Patent number 11,506,982
- Issue date Nov 22, 2022
- Intel Corporation
- Vahidreza Parichehreh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-damascene zero-misalignment-via process for semiconductor pack...
- Patent number 11,264,307
- Issue date Mar 1, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First layer interconnect first on carrier approach for EMIB patch
- Patent number 11,088,103
- Issue date Aug 10, 2021
- Intel Corporation
- Changhua Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic etching systems and methods using a photochemically enh...
- Patent number 10,438,812
- Issue date Oct 8, 2019
- Intel Corporation
- Jeremy D. Ecton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-damascene zero-misalignment-via process for semiconductor pack...
- Patent number 10,403,564
- Issue date Sep 3, 2019
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-destructive 3-dimensional chemical imaging of photo-resist mate...
- Patent number 10,078,204
- Issue date Sep 18, 2018
- Intel Corporation
- Nilanjan Z. Ghosh
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FO...
- Publication number 20250006645
- Publication date Jan 2, 2025
- Intel Corporation
- Xiao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING REPLACEABLE FIBER CO...
- Publication number 20240329339
- Publication date Oct 3, 2024
- Intel Corporation
- Jeremy Ecton
- G02 - OPTICS
Information Patent Application
CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE
- Publication number 20240329333
- Publication date Oct 3, 2024
- Intel Corporation
- Robert May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUITS WITH GLASS CORES
- Publication number 20240219629
- Publication date Jul 4, 2024
- Intel Corporation
- Changhua Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PR...
- Publication number 20240222130
- Publication date Jul 4, 2024
- Intel Corporation
- Shaojiang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGE SUBSTRATE WITH VERTICAL OPTICAL...
- Publication number 20240192453
- Publication date Jun 13, 2024
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Application
LITHOGRAPHIC PROCESSES FOR MAKING POLYMER-BASED ELEMENTS
- Publication number 20240184209
- Publication date Jun 6, 2024
- Intel Corporation
- Changhua LIU
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLAS...
- Publication number 20240176070
- Publication date May 30, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS
- Publication number 20240162191
- Publication date May 16, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE
- Publication number 20240113158
- Publication date Apr 4, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY COUPLED OPTICAL INTERPOSER
- Publication number 20240111090
- Publication date Apr 4, 2024
- Intel Corporation
- Robert A. May
- G02 - OPTICS
Information Patent Application
MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER
- Publication number 20240112972
- Publication date Apr 4, 2024
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ACHIEVE TILTED PATTERNING WITH A THROUGH RESIST THICKNESS...
- Publication number 20230236517
- Publication date Jul 27, 2023
- Intel Corporation
- Changhua LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POSITION CONTROLLED WAVEGUIDES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20230104330
- Publication date Apr 6, 2023
- Intel Corporation
- Jeremy Ecton
- G02 - OPTICS
Information Patent Application
METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN SE...
- Publication number 20230095281
- Publication date Mar 30, 2023
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL WAVEGUIDES WITHIN A GLASS SUBSTRATE TO OPTICALLY COUPLE DIE...
- Publication number 20230091050
- Publication date Mar 23, 2023
- Intel Corporation
- Zhichao ZHANG
- G02 - OPTICS
Information Patent Application
DIE FIRST FAN-OUT ARCHITECTURE FOR ELECTRIC AND OPTICAL INTEGRATION
- Publication number 20230090133
- Publication date Mar 23, 2023
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE LAST AND WAVEGUIDE LAST ARCHITECTURE FOR SILICON PHOTONIC PACKA...
- Publication number 20230087124
- Publication date Mar 23, 2023
- Bai Nie
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT TO GLASS SUBSTRATE ALIGNMENT THROUGH IN...
- Publication number 20230077633
- Publication date Mar 16, 2023
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT TO GLASS SUBSTRATE ALIGNMENT THROUGH DU...
- Publication number 20230077939
- Publication date Mar 16, 2023
- Changhua Liu
- G02 - OPTICS
Information Patent Application
FIRST LAYER INTERCONNECT FIRST ON CARRIER APPROACH FOR EMIB PATCH
- Publication number 20230027030
- Publication date Jan 26, 2023
- Intel Corporation
- Changhua LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD AND SYSTEM FOR OPTICAL COMMUNICATION WITH A PHOTONIC...
- Publication number 20220413214
- Publication date Dec 29, 2022
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Application
DEVICE, METHOD AND SYSTEM FOR OPTICAL COMMUNICATION WITH A WAVEGUID...
- Publication number 20220413210
- Publication date Dec 29, 2022
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Application
TECHNOLOGIES FOR ALIGNED VIAS
- Publication number 20220406654
- Publication date Dec 22, 2022
- Intel Corporation
- Changhua Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR ALIGNED VIAS OVER MULTIPLE LAYERS
- Publication number 20220406618
- Publication date Dec 22, 2022
- Intel Corporation
- Changhua Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST LAYER INTERCONNECT FIRST ON CARRIER APPROACH FOR EMIB PATCH
- Publication number 20210343673
- Publication date Nov 4, 2021
- Intel Corporation
- Changhua LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE DRY FILM RESIST FOR PHOTOLITHOGRAPHY
- Publication number 20210318612
- Publication date Oct 14, 2021
- Intel Corporation
- Hongxia FENG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD TO ACHIEVE TILTED PATTERNING WITH A THROUGH RESIST THICKNESS...
- Publication number 20210191282
- Publication date Jun 24, 2021
- Intel Corporation
- Changhua LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FIRST LAYER INTERCONNECT FIRST ON CARRIER APPROACH FOR EMIB PATCH
- Publication number 20200286847
- Publication date Sep 10, 2020
- Intel Corporation
- Changhua LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRISM-MASK FOR ANGLED PATTERNING APPLICATIONS
- Publication number 20200096873
- Publication date Mar 26, 2020
- Vahidreza PARICHEHREH
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Changhua LIU

Person

Patents Grantslast 30 patents

Device, method and system for optical communication with a waveguid...

Substrate with variable height conductive and dielectric elements

Method to achieve tilted patterning with a through resist thickness...

Method to achieve tilted patterning with a through resist thickness

Prism-mask for angled patterning applications

Dual-damascene zero-misalignment-via process for semiconductor pack...

First layer interconnect first on carrier approach for EMIB patch

Anisotropic etching systems and methods using a photochemically enh...

Dual-damascene zero-misalignment-via process for semiconductor pack...

Non-destructive 3-dimensional chemical imaging of photo-resist mate...

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FO...

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING REPLACEABLE FIBER CO...

CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE

PHOTONIC INTEGRATED CIRCUITS WITH GLASS CORES

ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PR...

PHOTONIC INTEGRATED CIRCUIT PACKAGE SUBSTRATE WITH VERTICAL OPTICAL...

LITHOGRAPHIC PROCESSES FOR MAKING POLYMER-BASED ELEMENTS

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLAS...

PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS

HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE

DIRECTLY COUPLED OPTICAL INTERPOSER

MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER

METHOD TO ACHIEVE TILTED PATTERNING WITH A THROUGH RESIST THICKNESS...

POSITION CONTROLLED WAVEGUIDES AND METHODS OF MANUFACTURING THE SAME

METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN SE...

OPTICAL WAVEGUIDES WITHIN A GLASS SUBSTRATE TO OPTICALLY COUPLE DIE...

DIE FIRST FAN-OUT ARCHITECTURE FOR ELECTRIC AND OPTICAL INTEGRATION

DIE LAST AND WAVEGUIDE LAST ARCHITECTURE FOR SILICON PHOTONIC PACKA...

PHOTONIC INTEGRATED CIRCUIT TO GLASS SUBSTRATE ALIGNMENT THROUGH IN...

PHOTONIC INTEGRATED CIRCUIT TO GLASS SUBSTRATE ALIGNMENT THROUGH DU...

FIRST LAYER INTERCONNECT FIRST ON CARRIER APPROACH FOR EMIB PATCH

DEVICE, METHOD AND SYSTEM FOR OPTICAL COMMUNICATION WITH A PHOTONIC...

DEVICE, METHOD AND SYSTEM FOR OPTICAL COMMUNICATION WITH A WAVEGUID...

TECHNOLOGIES FOR ALIGNED VIAS

TECHNOLOGIES FOR ALIGNED VIAS OVER MULTIPLE LAYERS

FIRST LAYER INTERCONNECT FIRST ON CARRIER APPROACH FOR EMIB PATCH

COMPOSITE DRY FILM RESIST FOR PHOTOLITHOGRAPHY

METHOD TO ACHIEVE TILTED PATTERNING WITH A THROUGH RESIST THICKNESS...

FIRST LAYER INTERCONNECT FIRST ON CARRIER APPROACH FOR EMIB PATCH

PRISM-MASK FOR ANGLED PATTERNING APPLICATIONS