Changoh Kim

Person

Incheon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of making double shielding layers o...
- Patent number 12,362,287
- Issue date Jul 15, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded semiconductor package with open terminal and methods of ma...
- Patent number 12,341,108
- Issue date Jun 24, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming multi-layer shielding st...
- Patent number 12,327,799
- Issue date Jun 10, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding and method of makin...
- Patent number 12,288,753
- Issue date Apr 29, 2025
- STATS ChipPAC Pte. Ltd.
- Changoh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PSPI-based patterning method for RDL
- Patent number 12,288,781
- Issue date Apr 29, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective EMI shielding using preformed mask with fang design
- Patent number 12,266,615
- Issue date Apr 1, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a slot in EMI shielding...
- Patent number 12,255,152
- Issue date Mar 18, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 12,211,804
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective EMI shielding using preformed mask
- Patent number 11,990,424
- Issue date May 21, 2024
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 11,935,840
- Issue date Mar 19, 2024
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming electrical circuit patte...
- Patent number 11,923,260
- Issue date Mar 5, 2024
- STATS ChipPAC Pte. Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask design for improved attach position
- Patent number 11,862,478
- Issue date Jan 2, 2024
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-based redistribution and multi-stacked packages
- Patent number 11,862,572
- Issue date Jan 2, 2024
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded semiconductor package with open terminal and methods of ma...
- Patent number 11,784,133
- Issue date Oct 10, 2023
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a slot in EMI shielding...
- Patent number 11,756,897
- Issue date Sep 12, 2023
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PSPI-based patterning method for RDL
- Patent number 11,749,668
- Issue date Sep 5, 2023
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded semiconductor packages with open terminals and methods of...
- Patent number 11,728,281
- Issue date Aug 15, 2023
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 11,715,703
- Issue date Aug 1, 2023
- STATS ChipPAC Pte. Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Emi shielding for flip chip package with exposed die backside
- Patent number 11,688,697
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Dong Won Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective EMI shielding using preformed mask
- Patent number 11,664,327
- Issue date May 30, 2023
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of embedding circuit pattern in enc...
- Patent number 11,652,065
- Issue date May 16, 2023
- STATS ChipPAC Pte. Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a slot in EMI shielding...
- Patent number 11,640,944
- Issue date May 2, 2023
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective EMI shielding using preformed mask with fang design
- Patent number 11,616,025
- Issue date Mar 28, 2023
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-based redistribution and multi-stacked packages
- Patent number 11,610,847
- Issue date Mar 21, 2023
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming electrical circuit patte...
- Patent number 11,581,233
- Issue date Feb 14, 2023
- STATS ChipPAC Pte. Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 11,444,035
- Issue date Sep 13, 2022
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask design for improved attach position
- Patent number 11,393,698
- Issue date Jul 19, 2022
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 11,355,452
- Issue date Jun 7, 2022
- STATS ChipPAC Pte. Ltd.
- Dong Won Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 11,342,278
- Issue date May 24, 2022
- STATS ChipPAC Pte. Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding and method of makin...
- Patent number 11,088,082
- Issue date Aug 10, 2021
- STATS ChipPAC Pte. Ltd.
- Changoh Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Selective EMI Shielding Using Preformed Mask with Fang Design
- Publication number 20250201729
- Publication date Jun 19, 2025
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Shielding Material Conta...
- Publication number 20240379580
- Publication date Nov 14, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SHIELDING LAYER OVER A SEMICONDUCTOR PACKAGE W...
- Publication number 20240347477
- Publication date Oct 17, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTIALLY SHIELDED SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240339394
- Publication date Oct 10, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming High Crystal Quality Mag...
- Publication number 20240332207
- Publication date Oct 3, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240332151
- Publication date Oct 3, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240250062
- Publication date Jul 25, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240234270
- Publication date Jul 11, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Partial EMI Shielding Removal Using Laser...
- Publication number 20240170416
- Publication date May 23, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Electrical Circuit Patte...
- Publication number 20240162103
- Publication date May 16, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240120291
- Publication date Apr 11, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-Based Redistribution and Multi-Stacked Packages
- Publication number 20240113038
- Publication date Apr 4, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240112981
- Publication date Apr 4, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Partial EMI Shielding
- Publication number 20240063137
- Publication date Feb 22, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH PYRAMIDAL SHIELDING AND METHOD FOR MAKIN...
- Publication number 20240055368
- Publication date Feb 15, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming EMI Shielding Material i...
- Publication number 20240021536
- Publication date Jan 18, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Heat Dissipation Using Graphene
- Publication number 20240014093
- Publication date Jan 11, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Magnetic Shielding
- Publication number 20240006335
- Publication date Jan 4, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Double Shielding
- Publication number 20230420382
- Publication date Dec 28, 2023
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielded Semiconductor Package with Open Terminal and Methods of Ma...
- Publication number 20230402401
- Publication date Dec 14, 2023
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Slot in EMI Shielding...
- Publication number 20230369241
- Publication date Nov 16, 2023
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PSPI-based Patterning Method for RDL
- Publication number 20230361103
- Publication date Nov 9, 2023
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective EMI Shielding Using Preformed Mask
- Publication number 20230275034
- Publication date Aug 31, 2023
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Selective EMI Shielding...
- Publication number 20230215812
- Publication date Jul 6, 2023
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Manufacturing Equipment and Method of Expelling Resid...
- Publication number 20230215721
- Publication date Jul 6, 2023
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- B08 - CLEANING
Information Patent Application
Selective EMI Shielding Using Preformed Mask with Fang Design
- Publication number 20230207485
- Publication date Jun 29, 2023
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-Based Redistribution and Multi-Stacked Packages
- Publication number 20230170311
- Publication date Jun 1, 2023
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Reducing Metal Burrs Using Lase...
- Publication number 20230170245
- Publication date Jun 1, 2023
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Electrical Circuit Patte...
- Publication number 20230154812
- Publication date May 18, 2023
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PSPI-based Patterning Method for RDL
- Publication number 20220399323
- Publication date Dec 15, 2022
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS

Changoh Kim

Person

Patents Grantslast 30 patents

Semiconductor device and method of making double shielding layers o...

Shielded semiconductor package with open terminal and methods of ma...

Semiconductor device and method of forming multi-layer shielding st...

Semiconductor device with partial EMI shielding and method of makin...

PSPI-based patterning method for RDL

Selective EMI shielding using preformed mask with fang design

Semiconductor device and method of forming a slot in EMI shielding...

Semiconductor device with partial EMI shielding removal using laser...

Selective EMI shielding using preformed mask

Semiconductor device with partial EMI shielding removal using laser...

Semiconductor device and method of forming electrical circuit patte...

Mask design for improved attach position

Laser-based redistribution and multi-stacked packages

Shielded semiconductor package with open terminal and methods of ma...

Semiconductor device and method of forming a slot in EMI shielding...

PSPI-based patterning method for RDL

Shielded semiconductor packages with open terminals and methods of...

EMI shielding for flip chip package with exposed die backside

Emi shielding for flip chip package with exposed die backside

Selective EMI shielding using preformed mask

Semiconductor device and method of embedding circuit pattern in enc...

Semiconductor device and method of forming a slot in EMI shielding...

Selective EMI shielding using preformed mask with fang design

Laser-based redistribution and multi-stacked packages

Semiconductor device and method of forming electrical circuit patte...

Semiconductor device with partial EMI shielding removal using laser...

Mask design for improved attach position

EMI shielding for flip chip package with exposed die backside

EMI shielding for flip chip package with exposed die backside

Semiconductor device with partial EMI shielding and method of makin...

Patents Applicationslast 30 patents

Selective EMI Shielding Using Preformed Mask with Fang Design

Semiconductor Device and Method of Forming Shielding Material Conta...

METHOD FOR FORMING A SHIELDING LAYER OVER A SEMICONDUCTOR PACKAGE W...

PARTIALLY SHIELDED SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

Semiconductor Device and Method of Forming High Crystal Quality Mag...

INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

Semiconductor Device with Partial EMI Shielding Removal Using Laser...

Semiconductor Device and Method of Forming Electrical Circuit Patte...

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

Laser-Based Redistribution and Multi-Stacked Packages

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

Semiconductor Device and Method for Partial EMI Shielding

SEMICONDUCTOR DEVICES WITH PYRAMIDAL SHIELDING AND METHOD FOR MAKIN...

Semiconductor Device and Method of Forming EMI Shielding Material i...

Semiconductor Device and Method of Heat Dissipation Using Graphene

Semiconductor Device and Method of Forming Embedded Magnetic Shielding

Semiconductor Device and Method of Double Shielding

Shielded Semiconductor Package with Open Terminal and Methods of Ma...

Semiconductor Device and Method of Forming a Slot in EMI Shielding...

PSPI-based Patterning Method for RDL

Selective EMI Shielding Using Preformed Mask

Semiconductor Device and Method of Forming Selective EMI Shielding...

Semiconductor Manufacturing Equipment and Method of Expelling Resid...

Selective EMI Shielding Using Preformed Mask with Fang Design

Laser-Based Redistribution and Multi-Stacked Packages

Semiconductor Device and Method for Reducing Metal Burrs Using Lase...

Semiconductor Device and Method of Forming Electrical Circuit Patte...

PSPI-based Patterning Method for RDL