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Changsheng Chen
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Santa Clara, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated passive components and package with posts
Patent number
6,954,130
Issue date
Oct 11, 2005
ChipScale, Inc.
Phil P. Marcoux
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated passive components and package with posts
Patent number
6,946,734
Issue date
Sep 20, 2005
ChipScale, Inc.
Phil P. Marcoux
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated passive components and package with posts
Patent number
6,833,986
Issue date
Dec 21, 2004
ChipScale, Inc.
Phil P. Marcoux
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated passive components and package with posts
Patent number
6,414,585
Issue date
Jul 2, 2002
ChipScale, Inc.
Phil P. Marcoux
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer fabrication of die-bottom contacts for electronic devices
Patent number
6,221,751
Issue date
Apr 24, 2001
ChipScale, Inc.
Changsheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component package with posts on the active side of the s...
Patent number
6,051,489
Issue date
Apr 18, 2000
ChipScale, Inc.
James L. Young
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer fabrication of die-bottom contacts for electronic devices
Patent number
5,910,687
Issue date
Jun 8, 1999
ChipScale, Inc.
Changsheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Integrated passive components and package with posts
Publication number
20040160299
Publication date
Aug 19, 2004
Phil P. Marcoux
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated passive components and package with posts
Publication number
20040160727
Publication date
Aug 19, 2004
Phil P. Marcoux
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated passive components and package with posts
Publication number
20020101329
Publication date
Aug 1, 2002
Phil P. Marcoux
H01 - BASIC ELECTRIC ELEMENTS