Changxue Wang

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Potsdam, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming through-base wafer vias
- Patent number 9,496,146
- Issue date Nov 15, 2016
- BASF SE
- Yuzhuo Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING THROUGH-BASE WAFER VIAS
- Publication number 20130344696
- Publication date Dec 26, 2013
- BASF SE
- Yuzhuo Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLURRY CONTAINING MULTI-OXIDIZER AND MIXED NANO-ABRASIVES FOR TUNGS...
- Publication number 20110186542
- Publication date Aug 4, 2011
- ASPT, INC.
- Yuzhuo LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Slurry containing multi-oxidizer and nano-abrasives for tungsten CMP
- Publication number 20090047787
- Publication date Feb 19, 2009
- Yuzhuo Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...