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Ilsan-si, KR
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last 30 patents
Information
Patent Grant
Integrated circuit direct cooling systems having substrates in cont...
Patent number
11,967,540
Issue date
Apr 23, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Seungwon Im
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having a spacer with a junction cooling pipe
Patent number
11,201,105
Issue date
Dec 14, 2021
Semiconductor Components Industries, LLC
Seungwon Im
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertically stacked multichip modules
Patent number
10,658,342
Issue date
May 19, 2020
Semiconductor Components Industries, LLC
Mankyo Jong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having junction cooling pipes embedded in sub...
Patent number
10,607,919
Issue date
Mar 31, 2020
Semiconductor Components Industries, LLC
Seungwon Im
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertically stacked multichip modules
Patent number
10,483,237
Issue date
Nov 19, 2019
Semiconductor Components Industries, LLC
Mankyo Jong
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
Publication number
20240234246
Publication date
Jul 11, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Seungwon IM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
Publication number
20220093487
Publication date
Mar 24, 2022
Semiconductor Components Industries, LLC
Seungwon IM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
Publication number
20200185305
Publication date
Jun 11, 2020
Semiconductor Components Industries, LLC
Seungwon IM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VERTICALLY STACKED MULTICHIP MODULES
Publication number
20190393196
Publication date
Dec 26, 2019
Semiconductor Components Industries, LLC
Mankyo JONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
Publication number
20180315681
Publication date
Nov 1, 2018
Semiconductor Components Industries, LLC
Seungwon IM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VERTICALLY STACKED MULTICHIP MODULES
Publication number
20180138152
Publication date
May 17, 2018
FAIRCHILD KOREA SEMICONDUCTOR LTD.
Mankyo JONG
H01 - BASIC ELECTRIC ELEMENTS