CHANMI LEE

Person

Sejong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with intermetallic-compound solder-joint comp...
- Patent number 12,206,056
- Issue date Jan 21, 2025
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring and bonding of devices
- Patent number 11,677,060
- Issue date Jun 13, 2023
- ELECTRONICS AND TELEOCMMUNICATIONS RESEARCH INSTITUTE
- Jiho Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire for electric bonding
- Patent number 11,618,109
- Issue date Apr 4, 2023
- Electronics and Telecommunications Research Institute
- Gwang-Mun Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS
- Publication number 20240021570
- Publication date Jan 18, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jiho JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILYL ETHER ISOHEXIDE-BASED ORGANIC-INORGANIC COMPOUND, METHOD FOR...
- Publication number 20230391956
- Publication date Dec 7, 2023
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- GWANG-MUN CHOI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MICROWAVE HEATING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20230326810
- Publication date Oct 12, 2023
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- GWANG-MUN CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND ITS REPAIR METHOD
- Publication number 20230027892
- Publication date Jan 26, 2023
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- KWANG-SEONG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER CONTROL STRUCTURE AND LASER BONDING METHOD USING THE SAME
- Publication number 20220402070
- Publication date Dec 22, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Ki Seok JANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRIC DEVICE
- Publication number 20220384674
- Publication date Dec 1, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jiho JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20220102603
- Publication date Mar 31, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...
- Publication number 20220077099
- Publication date Mar 10, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Gwang-Mun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE FOR ELECTRIC BONDING
- Publication number 20210402525
- Publication date Dec 30, 2021
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- GWANG-MUN CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR TRANSFERRING AND BONDING OF DEVICES
- Publication number 20210320236
- Publication date Oct 14, 2021
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jiho JOO
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package with intermetallic-compound solder-joint comp...

Method for transferring and bonding of devices

Wire for electric bonding

Patents Applicationslast 30 patents

BONDING APPARATUS

SILYL ETHER ISOHEXIDE-BASED ORGANIC-INORGANIC COMPOUND, METHOD FOR...

MICROWAVE HEATING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

ELECTRONIC DEVICE AND ITS REPAIR METHOD

LASER CONTROL STRUCTURE AND LASER BONDING METHOD USING THE SAME

METHOD OF MANUFACTURING ELECTRIC DEVICE

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...

WIRE FOR ELECTRIC BONDING

METHOD FOR TRANSFERRING AND BONDING OF DEVICES