Chanyuan LIU

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,205,829
- Issue date Jan 21, 2025
- Advanced Semiconductor Engineering, Inc.
- Chanyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,009,312
- Issue date Jun 11, 2024
- Advanced Semiconductor Engineering, Inc.
- Chanyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device package and method for manufacturing the same
- Patent number 11,837,686
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Chanyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,557,684
- Issue date Jan 17, 2023
- Advanced Semiconductor Engineering, Inc.
- Chanyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures and methods of manufacturing the same
- Patent number 11,239,178
- Issue date Feb 1, 2022
- Advanced Semiconductor Engineering, Inc.
- Chanyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,930,802
- Issue date Feb 23, 2021
- Advanced Semiconductor Engineering, Inc.
- Chanyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,910,233
- Issue date Feb 2, 2021
- Advanced Semiconductor Engineering, Inc.
- Chanyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20230092873
- Publication date Mar 23, 2023
- Advanced Semiconductor Engineering, Inc.
- Chanyuan LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210175373
- Publication date Jun 10, 2021
- Advanced Semiconductor Engineering, Inc.
- Chanyuan LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210159090
- Publication date May 27, 2021
- Advanced Semiconductor Engineering, Inc.
- Chanyuan LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200185581
- Publication date Jun 11, 2020
- Advanced Semiconductor Engineering, Inc.
- Chanyuan LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20200176394
- Publication date Jun 4, 2020
- Advanced Semiconductor Engineering, Inc.
- Chanyuan LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190341505
- Publication date Nov 7, 2019
- Advanced Semiconductor Engineering, Inc.
- Chanyuan LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190318938
- Publication date Oct 17, 2019
- Advanced Semiconductor Engineering, Inc.
- Chanyuan LIU
- H01 - BASIC ELECTRIC ELEMENTS

Chanyuan LIU

Person

Patents Grantslast 30 patents

Semiconductor device package and method of manufacturing the same

Semiconductor device package

Optical device package and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor package structures and methods of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

OPTICAL DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME