Chao Cheng Liu

Person

Kaohsiung County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,142,571
- Issue date Nov 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Chao Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with magnetic assembly
- Patent number 11,950,926
- Issue date Apr 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Chao Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,527,480
- Issue date Dec 13, 2022
- Advanced Semiconductor Engineering, Inc.
- Chao Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,362,036
- Issue date Jun 14, 2022
- Advanced Semiconductor Engineering, Inc.
- Chao Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,157,821
- Issue date Dec 18, 2018
- Advanced Semiconductor Engineering, Inc.
- Chao Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package
- Patent number 8,889,488
- Issue date Nov 18, 2014
- Advanced Semiconductor Engineering, Inc.
- Shin-Hua Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 8,546,950
- Issue date Oct 1, 2013
- Advanced Semiconductor Engineering Inc.
- Shin-Hua Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced package structure
- Patent number 8,059,422
- Issue date Nov 15, 2011
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 7,902,650
- Issue date Mar 8, 2011
- Advanced Semiconductor Engineering, Inc.
- Chia Chien Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked type chip package structure including a chip package and a...
- Patent number 7,834,469
- Issue date Nov 16, 2010
- Advanced Semiconductor Engineering, Inc.
- Yao-Kai Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package process
- Patent number 7,614,888
- Issue date Nov 10, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT WITH AND METHOD FOR CONNECTION OF A PLURALITY OF...
- Publication number 20240266371
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Wei Fong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONTSIDE DEEP TRENCH ISOLATION (FDTI) STRUCTURE FOR CMOS IMAGE SENSOR
- Publication number 20240266375
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Te Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC WEARABLE DEVICE
- Publication number 20240126327
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Chao Wei LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE WITH MAGNETIC ASSEMBLY
- Publication number 20230301591
- Publication date Sep 28, 2023
- Advanced Semiconductor Engineering, Inc.
- Chao Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSORS AND MANUFACTURING METHODS THEREOF
- Publication number 20230141681
- Publication date May 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Te Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230114278
- Publication date Apr 13, 2023
- Advanced Semiconductor Engineering, Inc.
- Chao Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220310521
- Publication date Sep 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Chao Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210343649
- Publication date Nov 4, 2021
- Advanced Semiconductor Engineering, Inc.
- Chao Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210210433
- Publication date Jul 8, 2021
- Advanced Semiconductor Engineering, Inc.
- Chao Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20180350724
- Publication date Dec 6, 2018
- Advanced Semiconductor Engineering, Inc.
- Chao Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20140011325
- Publication date Jan 9, 2014
- Advanced Semiconductor Engineering, Inc.
- Shin-Hua CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120032341
- Publication date Feb 9, 2012
- Shin-Hua CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090289338
- Publication date Nov 26, 2009
- Advanced Semiconductor Engineering, Inc.
- Chia Chien HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090289339
- Publication date Nov 26, 2009
- Advanced Semiconductor Engineering, Inc.
- Chia Chien HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE...
- Publication number 20090278243
- Publication date Nov 12, 2009
- Advanced Semiconductor Engineering, Inc.
- Yao-Kai Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TYPE CHIP PACKAGE STRUCTURE
- Publication number 20090278242
- Publication date Nov 12, 2009
- Advanced Semiconductor Engineering, Inc.
- Yao-Kai Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20090267210
- Publication date Oct 29, 2009
- Yao-Kai CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE PROCESS
- Publication number 20090087947
- Publication date Apr 2, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PROCESS AND STRUCTURE OF A THERMALLY ENHANCED PACKAGE
- Publication number 20090075027
- Publication date Mar 19, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B32 - LAYERED PRODUCTS

Chao Cheng Liu

Person

Patents Grantslast 30 patents

Semiconductor device package and method of manufacturing the same

Electronic device with magnetic assembly

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor packages

Method for manufacturing semiconductor package

Semiconductor package and manufacturing method thereof

Thermally enhanced package structure

Semiconductor package and method for manufacturing the same

Stacked type chip package structure including a chip package and a...

Flip chip package process

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT WITH AND METHOD FOR CONNECTION OF A PLURALITY OF...

FRONTSIDE DEEP TRENCH ISOLATION (FDTI) STRUCTURE FOR CMOS IMAGE SENSOR

ELECTRONIC WEARABLE DEVICE

ELECTRONIC DEVICE WITH MAGNETIC ASSEMBLY

CMOS IMAGE SENSORS AND MANUFACTURING METHODS THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE...

STACKED TYPE CHIP PACKAGE STRUCTURE

INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREOF

FLIP CHIP PACKAGE PROCESS

MANUFACTURING PROCESS AND STRUCTURE OF A THERMALLY ENHANCED PACKAGE