Chao-Chun Peng

Person

New Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including liner structure
- Patent number 12,027,419
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective formation of conductor nanowires
- Patent number 11,908,789
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-cover multifunctional image forming device
- Patent number 11,553,096
- Issue date Jan 10, 2023
- Avision Inc.
- Min-Hao Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multipurpose image capturing apparatus
- Patent number 11,039,026
- Issue date Jun 15, 2021
- Avision Inc.
- Shao-Lan Sheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 10,930,552
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Paper support
- Patent number D898029
- Issue date Oct 6, 2020
- Avision Inc.
- Chao-Yu Peng
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Selective formation of conductor nanowires
- Patent number 10,490,497
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 10,453,746
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Paper support
- Patent number D837803
- Issue date Jan 8, 2019
- Avision Inc.
- Chao-Yu Peng
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Paper support
- Patent number D837802
- Issue date Jan 8, 2019
- Avision Inc.
- Chao-Yu Peng
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 9,947,583
- Issue date Apr 17, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal spraying system
- Patent number 9,895,709
- Issue date Feb 20, 2018
- Taiwan Textile Research Institute
- Chao-Chun Peng
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Lithography using multilayer spacer for reduced spacer footing
- Patent number 9,892,933
- Issue date Feb 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 9,837,310
- Issue date Dec 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via pre-fill on back-end-of-the-line interconnect layer
- Patent number 9,728,503
- Issue date Aug 8, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal interconnection
- Patent number 9,721,887
- Issue date Aug 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnect structure that avoids via recess
- Patent number 9,646,932
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 9,570,347
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Multifunctional business machine
- Patent number 9,473,666
- Issue date Oct 18, 2016
- Chao-Yu Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Stacking tray device
- Patent number 9,469,493
- Issue date Oct 18, 2016
- Avision Inc.
- Chi-Yao Chen
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Interconnect structures comprising flexible buffer layers
- Patent number 9,466,525
- Issue date Oct 11, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal spraying apparatus and thermal spraying system
- Patent number 9,463,481
- Issue date Oct 11, 2016
- TAIWAN TEXTILE RESESARCH INSTITUTE
- Chao-Chun Peng
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Multi-mode scanner
- Patent number 9,402,008
- Issue date Jul 26, 2016
- Avision Inc.
- Chi-Yao Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for forming recess-free interconnect structure
- Patent number 9,385,029
- Issue date Jul 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for fabricating three-dimensional nonwoven fab...
- Patent number 9,260,807
- Issue date Feb 16, 2016
- Taiwan Textile Research Institute
- Kung-Chin Chang
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Grant
Method for forming interconnect structure that avoids via recess
- Patent number 9,252,049
- Issue date Feb 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-purpose scanner
- Patent number 9,247,097
- Issue date Jan 26, 2016
- Avision Inc.
- Chi-Yao Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Via pre-fill on back-end-of-the-line interconnect layer
- Patent number 9,219,033
- Issue date Dec 22, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithography using multilayer spacer for reduced spacer footing
- Patent number 9,159,579
- Issue date Oct 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scanner
- Patent number D732034
- Issue date Jun 16, 2015
- Avision Inc.
- Chi-Yao Chen
- D14 - Recording, communication, or information retrieval equipment

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE
- Publication number 20240321632
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Formation of Conductor Nanowires
- Publication number 20240153870
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-COVER MULTIFUNCTIONAL IMAGE FORMING DEVICE
- Publication number 20220159136
- Publication date May 19, 2022
- Avision Inc.
- Min-Hao Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE
- Publication number 20210407852
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPURPOSE IMAGE CAPTURING APPARATUS
- Publication number 20200329163
- Publication date Oct 15, 2020
- Avision Inc.
- Shao-Lan Sheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Selective Formation of Conductor Nanowires
- Publication number 20200091068
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Semiconductor Integrated Circuit Fabrication
- Publication number 20200051857
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method of Semiconductor Integrated Circuit Fabrication
- Publication number 20180233406
- Publication date Aug 16, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Semiconductor Integrated Circuit Fabrication
- Publication number 20170170066
- Publication date Jun 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Metal Interconnection
- Publication number 20170053864
- Publication date Feb 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SPRAYING SYSTEM
- Publication number 20160375455
- Publication date Dec 29, 2016
- TAIWAN TEXTILE RESEARCH INSTITUTE
- Chao-Chun Peng
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
MULTIFUNCTIONAL BUSINESS MACHINE
- Publication number 20160198062
- Publication date Jul 7, 2016
- Avision Inc.
- Chao-Yu Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for Forming Interconnect Structure that Avoids via Recess
- Publication number 20160148874
- Publication date May 26, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-MODE SCANNER
- Publication number 20160080598
- Publication date Mar 17, 2016
- Avision Inc.
- Chi-Yao CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
VIA PRE-FILL ON BACK-END-OF-THE-LINE INTERCONNECT LAYER
- Publication number 20160049373
- Publication date Feb 18, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lithography using Multilayer Spacer for Reduced Spacer Footing
- Publication number 20160027658
- Publication date Jan 28, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SPRAYING APPARATUS AND THERMAL SPRAYING SYSTEM
- Publication number 20150367361
- Publication date Dec 24, 2015
- TAIWAN TEXTILE RESEARCH INSTITUTE
- Chao-Chun Peng
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Selective Formation of Conductor Nanowires
- Publication number 20150364413
- Publication date Dec 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING TRAY DEVICE
- Publication number 20150353301
- Publication date Dec 10, 2015
- AVISION INC.
- CHI-YAO CHEN
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Method of Semiconductor Integrated Circuit Fabrication
- Publication number 20150270170
- Publication date Sep 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA PRE-FILL ON BACK-END-OF-THE-LINE INTERCONNECT LAYER
- Publication number 20150270215
- Publication date Sep 24, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PURPOSE SCANNER
- Publication number 20150256704
- Publication date Sep 10, 2015
- Avision Inc.
- CHI-YAO CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Interconnect Structures Comprising Flexible Buffer Layers
- Publication number 20150214102
- Publication date Jul 30, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Recess-Free Interconnect Structure
- Publication number 20150145134
- Publication date May 28, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20150132947
- Publication date May 14, 2015
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lithography using Multilayer Spacer for Reduced Spacer Footing
- Publication number 20150118850
- Publication date Apr 30, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING COPPER DAMASCENE
- Publication number 20140273434
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING INTERCONNECT STRUCTURE THAT AVOIDS VIA RECESS
- Publication number 20140252618
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Recess-Free Interconnect Structure
- Publication number 20140252622
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Semiconductor Integrated Circuit Fabrication
- Publication number 20140235050
- Publication date Aug 21, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- B82 - NANO-TECHNOLOGY

Chao-Chun Peng

Person

Patents Grantslast 30 patents

Semiconductor device including liner structure

Selective formation of conductor nanowires

Flip-cover multifunctional image forming device

Multipurpose image capturing apparatus

Method of semiconductor integrated circuit fabrication

Paper support

Selective formation of conductor nanowires

Method of semiconductor integrated circuit fabrication

Paper support

Paper support

Method of semiconductor integrated circuit fabrication

Thermal spraying system

Lithography using multilayer spacer for reduced spacer footing

Method of manufacturing a semiconductor device

Via pre-fill on back-end-of-the-line interconnect layer

Method of forming metal interconnection

Method for forming interconnect structure that avoids via recess

Method of semiconductor integrated circuit fabrication

Multifunctional business machine

Stacking tray device

Interconnect structures comprising flexible buffer layers

Thermal spraying apparatus and thermal spraying system

Multi-mode scanner

Method for forming recess-free interconnect structure

Apparatus and method for fabricating three-dimensional nonwoven fab...

Method for forming interconnect structure that avoids via recess

Multi-purpose scanner

Via pre-fill on back-end-of-the-line interconnect layer

Lithography using multilayer spacer for reduced spacer footing

Scanner

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE

Selective Formation of Conductor Nanowires

FLIP-COVER MULTIFUNCTIONAL IMAGE FORMING DEVICE

SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE

MULTIPURPOSE IMAGE CAPTURING APPARATUS

Selective Formation of Conductor Nanowires

Method of Semiconductor Integrated Circuit Fabrication

Method of Semiconductor Integrated Circuit Fabrication

Method of Semiconductor Integrated Circuit Fabrication

Method of Forming Metal Interconnection

THERMAL SPRAYING SYSTEM

MULTIFUNCTIONAL BUSINESS MACHINE

Method for Forming Interconnect Structure that Avoids via Recess

MULTI-MODE SCANNER

VIA PRE-FILL ON BACK-END-OF-THE-LINE INTERCONNECT LAYER

Lithography using Multilayer Spacer for Reduced Spacer Footing

THERMAL SPRAYING APPARATUS AND THERMAL SPRAYING SYSTEM

Selective Formation of Conductor Nanowires

STACKING TRAY DEVICE

Method of Semiconductor Integrated Circuit Fabrication

VIA PRE-FILL ON BACK-END-OF-THE-LINE INTERCONNECT LAYER

MULTI-PURPOSE SCANNER

Interconnect Structures Comprising Flexible Buffer Layers

Method for Forming Recess-Free Interconnect Structure

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Lithography using Multilayer Spacer for Reduced Spacer Footing

METHOD OF FABRICATING COPPER DAMASCENE

METHOD FOR FORMING INTERCONNECT STRUCTURE THAT AVOIDS VIA RECESS

Method for Forming Recess-Free Interconnect Structure

Method of Semiconductor Integrated Circuit Fabrication