Chao-Dung Suo

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Taichung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Flip-chip bonding structure on substrate for flip-chip package appl...
- Patent number 6,404,064
- Issue date Jun 11, 2002
- Siliconware Precision Industries Co., Ltd.
- Ying-Chou Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating solder bumps with high coplanarity for flip-c...
- Patent number 6,348,401
- Issue date Feb 19, 2002
- Siliconware Precision Industries Co., Ltd.
- Chih-Shun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure with dopants
- Patent number 6,348,740
- Issue date Feb 19, 2002
- Siliconware Precision Industries Co., Ltd.
- Shih-Kuang Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and fabrication method thereof
- Publication number 20060226542
- Publication date Oct 12, 2006
- Siliconware Precision Industries Co., Ltd.
- Feng-Lung Chien
- H01 - BASIC ELECTRIC ELEMENTS