Chao Gu

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Wuhan City, CN

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Patents Grantslast 30 patents

Information Patent Grant
Packaging structure and method of acoustic device
- Patent number 11,799,440
- Issue date Oct 24, 2023
- Wuhan MEMSonics Technologies Co., Ltd.
- Zhipeng Ding
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Manufacturing method of integrated circuit packaging structure
- Patent number 11,476,173
- Issue date Oct 18, 2022
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component comprising substrate with thermal indicator
- Patent number 11,469,153
- Issue date Oct 11, 2022
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Packaging Structure and Method of Acoustic Device
- Publication number 20230308073
- Publication date Sep 28, 2023
- Wuhan MEMSonics Technologies Co.,Ltd.
- Zhipeng DING
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC COMPONENT COMPRISING SUBSTRATE WITH THERMAL INDICATOR
- Publication number 20210082838
- Publication date Mar 18, 2021
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF INTEGRATED CIRCUIT PACKAGING STRUCTURE
- Publication number 20200335410
- Publication date Oct 22, 2020
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20200235023
- Publication date Jul 23, 2020
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS