Chao-Hsing LAI

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Showerhead assembly and method of servicing assembly for semiconduc...
- Patent number 12,080,545
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Wei Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film forming apparatus and method for reducing arcing
- Patent number 11,885,008
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Wei Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Showerhead assembly and method of servicing assembly for semiconduc...
- Patent number 11,769,659
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Wei Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film forming apparatus and method for reducing arcing
- Patent number 11,578,402
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Wei Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SHOWERHEAD ASSEMBLY AND METHOD OF SERVICING ASSEMBLY FOR SEMICONDUC...
- Publication number 20240371626
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Wei WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING APPARATUS AND METHOD FOR REDUCING ARCING
- Publication number 20240183025
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- PO-WEI WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SHOWERHEAD ASSEMBLY AND METHOD OF SERVICING ASSEMBLY FOR SEMICONDUC...
- Publication number 20230377871
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Wei WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING APPARATUS AND METHOD FOR REDUCING ARCING
- Publication number 20230183855
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- PO-WEI WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SHOWERHEAD ASSEMBLY AND METHOD OF SERVICING ASSEMBLY FOR SEMICONDUC...
- Publication number 20230060764
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING APPARATUS AND METHOD FOR REDUCING ARCING
- Publication number 20220380886
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- PO-WEI WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Chao-Hsing LAI

Person

Patents Grantslast 30 patents

Showerhead assembly and method of servicing assembly for semiconduc...

Film forming apparatus and method for reducing arcing

Showerhead assembly and method of servicing assembly for semiconduc...

Film forming apparatus and method for reducing arcing

Patents Applicationslast 30 patents

SHOWERHEAD ASSEMBLY AND METHOD OF SERVICING ASSEMBLY FOR SEMICONDUC...

FILM FORMING APPARATUS AND METHOD FOR REDUCING ARCING

SHOWERHEAD ASSEMBLY AND METHOD OF SERVICING ASSEMBLY FOR SEMICONDUC...

FILM FORMING APPARATUS AND METHOD FOR REDUCING ARCING

SHOWERHEAD ASSEMBLY AND METHOD OF SERVICING ASSEMBLY FOR SEMICONDUC...

FILM FORMING APPARATUS AND METHOD FOR REDUCING ARCING