Chao-Kun Tseng

Person

Tu-Chen, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Mounting assembly for heat sink
- Patent number 6,728,107
- Issue date Apr 27, 2004
- Hon Hai Precision Ind. Co., Ltd.
- Chao Kun Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink assembly for dissipating heat of an electronic package mo...
- Patent number 6,452,800
- Issue date Sep 17, 2002
- Hon Hai Precision Ind., Co., LTD
- Chao-Yang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making folded fin
- Patent number 6,442,836
- Issue date Sep 3, 2002
- Foxconn Precision Components Co., Ltd.
- Yu Ping Chen
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Heat dissipation device for integrated circuits
- Patent number 6,412,546
- Issue date Jul 2, 2002
- Foxconn Precision Components Co., Ltd.
- Yeu-Lih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for integrated circuit
- Patent number 6,318,451
- Issue date Nov 20, 2001
- Foxconn Precision Components Co., Ltd.
- Chao-Yang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink assembly for an electrical socket
- Patent number 6,317,323
- Issue date Nov 13, 2001
- Foxconn Precision Components Co., Ltd.
- Chao-Yang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink and retainer for electronic integrated devices
- Patent number 6,273,185
- Issue date Aug 14, 2001
- Foxconn Precision Components Co., Ltd.
- Yeu-Lih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Folded fin forming method, machine and folded fin obtained therefrom
- Patent number 6,195,874
- Issue date Mar 6, 2001
- Hon Hai Precision Ind. Co., Ltd.
- Y. P. Chen
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING ASSEMBLY FOR HEAT SINK
- Publication number 20040017660
- Publication date Jan 29, 2004
- Chao Kun Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink assembly for dissipating heat of an electronic package mo...
- Publication number 20010030853
- Publication date Oct 18, 2001
- Chao-Yang Lee
- H01 - BASIC ELECTRIC ELEMENTS

Chao-Kun Tseng

Person

Patents Grantslast 30 patents

Mounting assembly for heat sink

Heat sink assembly for dissipating heat of an electronic package mo...

Method of making folded fin

Heat dissipation device for integrated circuits

Heat sink for integrated circuit

Heat sink assembly for an electrical socket

Heat sink and retainer for electronic integrated devices

Folded fin forming method, machine and folded fin obtained therefrom

Patents Applicationslast 30 patents

MOUNTING ASSEMBLY FOR HEAT SINK

Heat sink assembly for dissipating heat of an electronic package mo...