Chao SHEN

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Embedded substrate, circuit board assembly, and electronic device
- Patent number 12,224,146
- Issue date Feb 11, 2025
- Huawei Technologies Co., Ltd.
- Chao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,075,558
- Issue date Aug 27, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Zhaozheng Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED PACKAGE STRUCTURE, POWER SUPPLY APPARATUS, AND ELECTRONIC...
- Publication number 20240121901
- Publication date Apr 11, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Chunyan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND COMMUNICATION DEVICE
- Publication number 20230299018
- Publication date Sep 21, 2023
- Huawei Technologies Co., Ltd
- Chen KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
- Publication number 20230028233
- Publication date Jan 26, 2023
- Huawei Technologies Co., Ltd
- Chao SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220201837
- Publication date Jun 23, 2022
- Huawei Digital Power Technologies Co., Ltd.
- Zhaozheng HOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR