Chao-Shun Hsu

Person

Sansing Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Programmable semiconductor interposer for electronic package and me...
- Patent number 8,945,998
- Issue date Feb 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures and methods for through substrate vias
- Patent number 8,704,375
- Issue date Apr 22, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Max Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip inductors with through-silicon-via fence for Q improvement
- Patent number 8,492,872
- Issue date Jul 23, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable semiconductor interposer for electronic package and me...
- Patent number 8,476,735
- Issue date Jul 2, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV-enabled twisted pair
- Patent number 7,812,426
- Issue date Oct 12, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mark Shane Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming single dies with multi-layer interconnect struc...
- Patent number 7,795,735
- Issue date Sep 14, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiP (system in package) design systems and methods
- Patent number 7,565,635
- Issue date Jul 21, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Clinton Chao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Design techniques for stacking identical memory dies
- Patent number 7,494,846
- Issue date Feb 24, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Shun Hsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Electromagnetic shielding using through-silicon vias
- Patent number 7,427,803
- Issue date Sep 23, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Clinton Chao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Programmable Semiconductor Interposer for Electronic Package and Me...
- Publication number 20130295727
- Publication date Nov 7, 2013
- Chao-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Structures and Methods for Through Substrate Vias
- Publication number 20100193954
- Publication date Aug 5, 2010
- Max Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRA HIGH BANDWIDTH MEMORY DIE STACK
- Publication number 20100174858
- Publication date Jul 8, 2010
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming-Fa CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TSV-Enabled Twisted Pair
- Publication number 20090294915
- Publication date Dec 3, 2009
- Mark Shane Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-chip inductors with through-silicon-via fence for Q improvement
- Publication number 20090090995
- Publication date Apr 9, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Programmable semiconductor interposer for electronic package and me...
- Publication number 20080296697
- Publication date Dec 4, 2008
- Chao-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP (SYSTEM IN PACKAGE) DESIGN SYSTEMS AND METHODS
- Publication number 20080250182
- Publication date Oct 9, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Clinton Chao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS FOR FORMING SINGLE DIES WITH MULTI-LAYER INTERCONNECT STRUC...
- Publication number 20080233710
- Publication date Sep 25, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Chao-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Design techniques for stacking identical memory dies
- Publication number 20080220565
- Publication date Sep 11, 2008
- Chao-Shun Hsu
- G11 - INFORMATION STORAGE

Chao-Shun Hsu

Person

Patents Grantslast 30 patents

Programmable semiconductor interposer for electronic package and me...

Barrier structures and methods for through substrate vias

On-chip inductors with through-silicon-via fence for Q improvement

Programmable semiconductor interposer for electronic package and me...

TSV-enabled twisted pair

Methods for forming single dies with multi-layer interconnect struc...

SiP (system in package) design systems and methods

Design techniques for stacking identical memory dies

Electromagnetic shielding using through-silicon vias

Patents Applicationslast 30 patents

Programmable Semiconductor Interposer for Electronic Package and Me...

Barrier Structures and Methods for Through Substrate Vias

EXTRA HIGH BANDWIDTH MEMORY DIE STACK

TSV-Enabled Twisted Pair

On-chip inductors with through-silicon-via fence for Q improvement

Programmable semiconductor interposer for electronic package and me...

SIP (SYSTEM IN PACKAGE) DESIGN SYSTEMS AND METHODS

METHODS FOR FORMING SINGLE DIES WITH MULTI-LAYER INTERCONNECT STRUC...

Design techniques for stacking identical memory dies