Chao-Tang CHIU

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Capacitive fingerprint sensor
- Patent number 12,131,572
- Issue date Oct 29, 2024
- AUO Corporation
- Xiang-Rui Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,655
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,051,639
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing device
- Patent number 11,869,270
- Issue date Jan 9, 2024
- AUO Corporation
- Shuo-Hong Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical sensing device
- Patent number 11,836,321
- Issue date Dec 5, 2023
- AUO Corporation
- Xiang-Rui Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Workpiece holder, wafer chuck, wafer holding method
- Patent number 11,791,192
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensing device and electronic apparatus having the same
- Patent number 11,781,905
- Issue date Oct 10, 2023
- Au Optronics Corporation
- Shih-Hua Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint sensing module
- Patent number 11,734,946
- Issue date Aug 22, 2023
- Au Optronics Corporation
- Chao-Chien Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint sensing device
- Patent number 11,715,323
- Issue date Aug 1, 2023
- Au Optronics Corporation
- Shih-Hua Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fan-out packages and methods of forming the same
- Patent number 11,664,300
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensing device
- Patent number 11,639,870
- Issue date May 2, 2023
- AUO Corporation
- Shih-Hua Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Biological feature identification device and manufacturing method o...
- Patent number 11,600,099
- Issue date Mar 7, 2023
- AU OPTRONICS CORPORATION
- Shuo-Hong Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint recognition device
- Patent number 11,574,496
- Issue date Feb 7, 2023
- Au Optronics Corporation
- Shang-Wei Hsieh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Switching regulator using protection circuit for avoiding voltage s...
- Patent number 11,557,971
- Issue date Jan 17, 2023
- Mediatek Inc.
- Wei-Chung Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Real/fake fingerprint recognition device, method, and non-transitor...
- Patent number 11,450,143
- Issue date Sep 20, 2022
- AU OPTRONICS CORPORATION
- Po-Chao Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint sensing module
- Patent number 11,308,307
- Issue date Apr 19, 2022
- Au Optronics Corporation
- Yu-Han Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Photosensitive element having substantially flat interface between...
- Patent number 11,227,874
- Issue date Jan 18, 2022
- Au Optronics Corporation
- Po-Chao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensor
- Patent number 11,139,404
- Issue date Oct 5, 2021
- Au Optronics Corporation
- Po-Chao Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Internet phone system
- Patent number 11,050,868
- Issue date Jun 29, 2021
- Pegatron Corporation
- Yu-Ti Kuo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Pixel array substrate
- Patent number 11,003,036
- Issue date May 11, 2021
- Au Optronics Corporation
- Ching-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array substrate
- Patent number 10,718,985
- Issue date Jul 21, 2020
- Au Optronics Corporation
- Ching-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving efficiency of power converter
- Patent number 10,707,756
- Issue date Jul 7, 2020
- Mediatek Inc.
- Chao-Chang Chiu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Display panel
- Patent number 10,424,603
- Issue date Sep 24, 2019
- Au Optronics Corporation
- Cheng-Chieh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internet phone system
- Patent number 10,397,385
- Issue date Aug 27, 2019
- Pegatron Corporation
- Yu-Ti Kuo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Knee voltage detector
- Patent number 9,570,990
- Issue date Feb 14, 2017
- NOVATEK Microelectronics Corp.
- Ke-Horng Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
TSV structure having insulating layers with embedded voids
- Patent number 9,379,043
- Issue date Jun 28, 2016
- Powertech Technology Inc.
- Ming-Yi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active device array substrate
- Patent number 9,252,167
- Issue date Feb 2, 2016
- AU OPTRONICS CORPORATION
- Jia-Hong Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active device array substrate and manufacturing method thereof
- Patent number 8,865,532
- Issue date Oct 21, 2014
- AU OPTRONICS CORPORATION
- Jia-Hong Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode with current blocking region
- Patent number 8,334,549
- Issue date Dec 18, 2012
- Lextar Electronics Corporation
- Mong-Ea Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection device in high voltage and manufacturing method for...
- Patent number 8,044,466
- Issue date Oct 25, 2011
- Mediatek Inc.
- Ding-Jeng Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250054892
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20250048765
- Publication date Feb 6, 2025
- AUO Corporation
- Shih-Hua Lu
- G02 - OPTICS
Information Patent Application
SENSING PANEL
- Publication number 20250046048
- Publication date Feb 6, 2025
- AUO Corporation
- Xiang-Rui CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT EMITTING DIODE STRUCTURE
- Publication number 20250006875
- Publication date Jan 2, 2025
- AUO Corporation
- Yang-En WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240387346
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240371827
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE FINGERPRINT SENSOR
- Publication number 20240338963
- Publication date Oct 10, 2024
- AUO Corporation
- Xiang-Rui Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROBUMP STRUCTURE WITH ENCLOSED JOINT WINDOW
- Publication number 20240339424
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332215
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR FORMING CONDUCTIVE BUMPS
- Publication number 20240312941
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240266316
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Treatment System for Uniform Processing of Semiconductor...
- Publication number 20240234192
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Forming the Same
- Publication number 20240186275
- Publication date Jun 6, 2024
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240107682
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER
- Publication number 20240096740
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240071952
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240063081
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD OF HANDLING W...
- Publication number 20230369094
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING DEVICE
- Publication number 20230351799
- Publication date Nov 2, 2023
- AUO Corporation
- Shuo-Hong Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT-SENSING DEVICE
- Publication number 20230352504
- Publication date Nov 2, 2023
- AUO Corporation
- Yu-Nung Mao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SENSING DEVICE
- Publication number 20230326914
- Publication date Oct 12, 2023
- AUO Corporation
- Shuo-Hong Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230282555
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSING DEVICE
- Publication number 20230027911
- Publication date Jan 26, 2023
- AUO Corporation
- Shih-Hua Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PHOTOSENSITIVE DEVICE
- Publication number 20230026699
- Publication date Jan 26, 2023
- AUO Corporation
- Shih-Hua Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL SENSING DEVICE
- Publication number 20230026218
- Publication date Jan 26, 2023
- AUO Corporation
- Xiang-Rui Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230014450
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSING DEVICE
- Publication number 20220375251
- Publication date Nov 24, 2022
- AU OPTRONICS CORPORATION
- Shih-Hua Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT RECOGNITION DEVICE
- Publication number 20220375250
- Publication date Nov 24, 2022
- AU OPTRONICS CORPORATION
- Shang-Wei Hsieh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL SENSING DEVICE AND ELECTRONIC APPARATUS HAVING THE SAME
- Publication number 20220373387
- Publication date Nov 24, 2022
- AU OPTRONICS CORPORATION
- Shih-Hua Lu
- G06 - COMPUTING CALCULATING COUNTING

Chao-Tang CHIU

Person

Patents Grantslast 30 patents

Capacitive fingerprint sensor

Package structure and method of forming the same

Package structure and manufacturing method thereof

Sensing device

Optical sensing device

Workpiece holder, wafer chuck, wafer holding method

Optical sensing device and electronic apparatus having the same

Fingerprint sensing module

Fingerprint sensing device

Fan-out packages and methods of forming the same

Optical sensing device

Biological feature identification device and manufacturing method o...

Fingerprint recognition device

Switching regulator using protection circuit for avoiding voltage s...

Real/fake fingerprint recognition device, method, and non-transitor...

Fingerprint sensing module

Photosensitive element having substantially flat interface between...

Photosensor

Internet phone system

Pixel array substrate

Pixel array substrate

Method for improving efficiency of power converter

Display panel

Internet phone system

Knee voltage detector

TSV structure having insulating layers with embedded voids

Active device array substrate

Active device array substrate and manufacturing method thereof

Light emitting diode with current blocking region

ESD protection device in high voltage and manufacturing method for...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

DISPLAY PANEL

SENSING PANEL

LIGHT EMITTING DIODE STRUCTURE

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

CAPACITIVE FINGERPRINT SENSOR

MICROBUMP STRUCTURE WITH ENCLOSED JOINT WINDOW

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

ELECTRONIC APPARATUS AND METHOD FOR FORMING CONDUCTIVE BUMPS

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

Method and Treatment System for Uniform Processing of Semiconductor...

Semiconductor Devices and Methods of Forming the Same

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER

INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD OF HANDLING W...

SENSING DEVICE

LIGHT-SENSING DEVICE

SENSING DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

OPTICAL SENSING DEVICE

PHOTOSENSITIVE DEVICE

OPTICAL SENSING DEVICE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

FINGERPRINT SENSING DEVICE

FINGERPRINT RECOGNITION DEVICE

OPTICAL SENSING DEVICE AND ELECTRONIC APPARATUS HAVING THE SAME