TREA

CHAO-TSUNG TSOU

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  • Hsinchu, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Taiko wafer ring cut process method
    • Patent number 11,551,923
    • Issue date Jan 10, 2023
    • PHOENIX SILICON INTERNATIONAL CORP.
    • Chien-Hsiung Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Manufacturing process of wafer thinning
    • Patent number 10,026,603
    • Issue date Jul 17, 2018
    • PHOENIX SILICON INTERNATIONAL CORP.
    • Shih-Ching Yang
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    CRUCIBLE AND VAPOR DEPOSITION APPARATUS
    • Publication number 20220228250
    • Publication date Jul 21, 2022
    • Phoenix Silicon International Corp.
    • CHIEN-HSIUNG HUANG
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    TAIKO WAFER RING CUT PROCESS METHOD
    • Publication number 20220230869
    • Publication date Jul 21, 2022
    • Phoenix Silicon International Corp.
    • CHIEN-HSIUNG HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING PROCESS OF WAFER THINNING
    • Publication number 20170372885
    • Publication date Dec 28, 2017
    • Phoenix Silicon International Corp.
    • SHIH-CHING YANG
    • H01 - BASIC ELECTRIC ELEMENTS