Chao-Yang YEH

Person

Luzhou City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Test probing structure
- Patent number 11,585,831
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices and structures thereof
- Patent number 11,183,392
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jiann-Horng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,861,830
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company
- Chao-Yang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test probing structure
- Patent number 10,782,318
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices and structures thereof
- Patent number 10,636,667
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jiann-Horng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,535,638
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company
- Chao-Yang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning method for semiconductor device and structures resulting...
- Patent number 10,340,141
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming funnel-like opening for semiconductor device stru...
- Patent number 10,276,378
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,262,974
- Issue date Apr 16, 2019
- Taiwan Semiconductor Manufacturing Company
- Chao-Yang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,002,854
- Issue date Jun 19, 2018
- Taiwan Semiconductor Manufacturing Company
- Chao-Yang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test probing structure
- Patent number 9,817,029
- Issue date Nov 14, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 9,741,688
- Issue date Aug 22, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Yang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers of 3-dimensional integrated circuit package systems and...
- Patent number 9,704,766
- Issue date Jul 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sandeep Kumar Goel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for validating stacked dies by comparing connections
- Patent number 9,646,128
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ashok Mehta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Common template for electronic article
- Patent number 9,613,174
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- William Wu Shen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Techniques for fast resonance convergence
- Patent number 9,542,517
- Issue date Jan 10, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Yang Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method
- Patent number 9,385,110
- Issue date Jul 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Yang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages having integrated devices and methods of forming same
- Patent number 9,385,073
- Issue date Jul 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Yang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 9,190,345
- Issue date Nov 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for determining effective capacitance to facili...
- Patent number 9,104,835
- Issue date Aug 11, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Yang Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for validating stacked dies by comparing connections
- Patent number 9,047,432
- Issue date Jun 2, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ashok Mehta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Common template for electronic article
- Patent number 9,003,338
- Issue date Apr 7, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- William Wu Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for determining effective capacitance to facili...
- Patent number 8,910,101
- Issue date Dec 9, 2014
- Taiwan Semiconductor Manfacturing Co., Ltd.
- Chao-Yang Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tool and method for modeling interposer RC couplings
- Patent number 8,856,710
- Issue date Oct 7, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Yang Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked die interconnect validation
- Patent number 8,402,404
- Issue date Mar 19, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ashok Mehta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reducing the switching noise on substrate with high grounding resis...
- Patent number 8,269,350
- Issue date Sep 18, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chia Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TEST PROBING STRUCTURE
- Publication number 20200379013
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Mill-Jer WANG
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES AND STRUCTURES THEREOF
- Publication number 20200258754
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- JIANN-HORNG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20200152606
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Yang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device
- Publication number 20190237435
- Publication date Aug 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Yang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES AND STRUCTURES THEREOF
- Publication number 20190157094
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- JIANN-HORNG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING FUNNEL-LIKE OPENING FOR SEMICONDUCTOR DEVICE STRU...
- Publication number 20190131131
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Hao WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterning Method for Semiconductor Device and Structures Resulting...
- Publication number 20180315601
- Publication date Nov 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20180158802
- Publication date Jun 7, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Yang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PROBING STRUCTURE
- Publication number 20180038894
- Publication date Feb 8, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Mill-Jer WANG
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device and Method
- Publication number 20170221863
- Publication date Aug 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Yang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20160315066
- Publication date Oct 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Yang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages Having Integrated Devices and Methods of Forming Same
- Publication number 20160056100
- Publication date Feb 25, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Yang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20150371951
- Publication date Dec 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Yang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF
- Publication number 20150348943
- Publication date Dec 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR VALIDATING STACKED DIES BY COMPARING CONNECTIONS
- Publication number 20150234979
- Publication date Aug 20, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Ashok MEHTA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMMON TEMPLATE FOR ELECTRONIC ARTICLE
- Publication number 20150213182
- Publication date Jul 30, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- William Wu Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR DETERMINING EFFECTIVE CAPACITANCE TO FACILI...
- Publication number 20150154343
- Publication date Jun 4, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Chao-Yang YEH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMMON TEMPLATE FOR ELECTRONIC ARTICLE
- Publication number 20140282305
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company Limited
- William Wu Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TECHNIQUES FOR FAST RESONANCE CONVERGENCE
- Publication number 20140183692
- Publication date Jul 3, 2014
- Chao-Yang Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED DIE INTERCONNECT VALIDATION
- Publication number 20130167095
- Publication date Jun 27, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Ashok MEHTA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TEST PROBING STRUCTURE
- Publication number 20130147505
- Publication date Jun 13, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Mill-Jer WANG
- G01 - MEASURING TESTING
Information Patent Application
TOOL AND METHOD FOR MODELING INTERPOSER RC COUPLINGS
- Publication number 20130007692
- Publication date Jan 3, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Chao-Yang Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERPOSERS OF 3-DIMENSIONAL INTEGRATED CIRCUIT PACKAGE SYSTEMS AND...
- Publication number 20120273782
- Publication date Nov 1, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sandeep Kumar GOEL
- H01 - BASIC ELECTRIC ELEMENTS

Chao-Yang YEH

Person

Patents Grantslast 30 patents

Test probing structure

Method for manufacturing semiconductor devices and structures thereof

Semiconductor device

Test probing structure

Method for manufacturing semiconductor devices and structures thereof

Semiconductor device

Patterning method for semiconductor device and structures resulting...

Method of forming funnel-like opening for semiconductor device stru...

Method of manufacturing a semiconductor device

Semiconductor device and method

Test probing structure

Method for manufacturing a semiconductor device

Interposers of 3-dimensional integrated circuit package systems and...

System and method for validating stacked dies by comparing connections

Common template for electronic article

Techniques for fast resonance convergence

Semiconductor device and method

Packages having integrated devices and methods of forming same

Semiconductor devices and methods of manufacture thereof

Systems and methods for determining effective capacitance to facili...

System and method for validating stacked dies by comparing connections

Common template for electronic article

Systems and methods for determining effective capacitance to facili...

Tool and method for modeling interposer RC couplings

Stacked die interconnect validation

Reducing the switching noise on substrate with high grounding resis...

Patents Applicationslast 30 patents

TEST PROBING STRUCTURE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES AND STRUCTURES THEREOF

Semiconductor Device

Method of Manufacturing a Semiconductor Device

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES AND STRUCTURES THEREOF

METHOD OF FORMING FUNNEL-LIKE OPENING FOR SEMICONDUCTOR DEVICE STRU...

Patterning Method for Semiconductor Device and Structures Resulting...

Semiconductor Device and Method

TEST PROBING STRUCTURE

Semiconductor Device and Method

Semiconductor Device and Method

Packages Having Integrated Devices and Methods of Forming Same

Semiconductor Device and Method

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF

SYSTEM AND METHOD FOR VALIDATING STACKED DIES BY COMPARING CONNECTIONS

COMMON TEMPLATE FOR ELECTRONIC ARTICLE

SYSTEMS AND METHODS FOR DETERMINING EFFECTIVE CAPACITANCE TO FACILI...

COMMON TEMPLATE FOR ELECTRONIC ARTICLE

TECHNIQUES FOR FAST RESONANCE CONVERGENCE

STACKED DIE INTERCONNECT VALIDATION

TEST PROBING STRUCTURE

TOOL AND METHOD FOR MODELING INTERPOSER RC COUPLINGS

INTERPOSERS OF 3-DIMENSIONAL INTEGRATED CIRCUIT PACKAGE SYSTEMS AND...