Chaochieh Tsai

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Cupertino, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional stacking structure
- Patent number 10,777,534
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peter Yu Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having magnetic bonding between substrates
- Patent number 10,157,885
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peter Yu-Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking structure and manufacturing method thereof
- Patent number 9,748,206
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peter Yu Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20180033773
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Peter Yu-Fei HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING STRUCTURE
- Publication number 20180012868
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Peter Yu Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS