Chaojun DENG

Person

Dongguan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board assembly and electronic device
- Patent number 12,058,803
- Issue date Aug 6, 2024
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip and manufacturing method thereof, and electronic device
- Patent number 11,862,529
- Issue date Jan 2, 2024
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly and electronic device
- Patent number 11,805,592
- Issue date Oct 31, 2023
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical interconnection structure and manufacturing method thereof...
- Patent number 11,776,820
- Issue date Oct 3, 2023
- Huawei Technologies Co., Ltd.
- Xiaoyun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communications network and related device
- Patent number 11,309,967
- Issue date Apr 19, 2022
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240107656
- Publication date Mar 28, 2024
- Huawei Technologies Co., Ltd
- Chaojun DENG
- G02 - OPTICS
Information Patent Application
Optical Phased Board, Manufacturing Method, and Optical Phased Arra...
- Publication number 20240085757
- Publication date Mar 14, 2024
- Huawei Technologies Co., Ltd
- Chaojun Deng
- G02 - OPTICS
Information Patent Application
OPTICAL CAGE ASSEMBLY, OPTICAL MODULE CONNECTOR, AND METHOD FOR MAN...
- Publication number 20230258890
- Publication date Aug 17, 2023
- Huawei Technologies Co., Ltd
- Xiaorui Liu
- G02 - OPTICS
Information Patent Application
CHIP PACKAGE STRUCTURE, PREPARATION METHOD, AND ELECTRONIC DEVICE
- Publication number 20220216171
- Publication date Jul 7, 2022
- Huawei Technologies Co., Ltd
- Chaojun DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
- Publication number 20220102237
- Publication date Mar 31, 2022
- Huawei Technologies Co., Ltd
- Chaojun DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF...
- Publication number 20220102164
- Publication date Mar 31, 2022
- Huawei Technologies Co., Ltd
- Xiaoyun WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20210212193
- Publication date Jul 8, 2021
- Huawei Technologies Co., Ltd
- Chaojun DENG
- G02 - OPTICS
Information Patent Application
Communications Network and Related Device
- Publication number 20200343975
- Publication date Oct 29, 2020
- Huawei Technologies Co., Ltd
- Chaojun DENG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Chaojun DENG

Person

Patents Grantslast 30 patents

Circuit board assembly and electronic device

Chip and manufacturing method thereof, and electronic device

Circuit board assembly and electronic device

Vertical interconnection structure and manufacturing method thereof...

Communications network and related device

Patents Applicationslast 30 patents

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

Optical Phased Board, Manufacturing Method, and Optical Phased Arra...

OPTICAL CAGE ASSEMBLY, OPTICAL MODULE CONNECTOR, AND METHOD FOR MAN...

CHIP PACKAGE STRUCTURE, PREPARATION METHOD, AND ELECTRONIC DEVICE

CHIP AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE

VERTICAL INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF...

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

Communications Network and Related Device