Charan Gurumuthy

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Higley, AZ, US

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Patents Applicationslast 30 patents

Information Patent Application
System, apparatus, and method for advanced solder bumping
- Publication number 20070152024
- Publication date Jul 5, 2007
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Assessing micro-via formation PCB substrate manufacturing process
- Publication number 20060091023
- Publication date May 4, 2006
- Ahsan Bukhari
- G01 - MEASURING TESTING