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Charavana K. Gurumurthy
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Gilbert, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Compartment for magnet placement
Patent number
10,317,952
Issue date
Jun 11, 2019
Intel Corporation
Sandeep S. Iyer
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Flexible microelectronic systems and methods of fabricating the same
Patent number
10,103,037
Issue date
Oct 16, 2018
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pad-less interconnect for electrical coreless substrate
Patent number
9,691,727
Issue date
Jun 27, 2017
Intel Corporation
Javier Soto Gonzalez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enabling package-on-package (PoP) pad surface finishes on bumpless...
Patent number
9,299,602
Issue date
Mar 29, 2016
Intel Corporation
Qinglei Zhang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Enabling package-on-package (PoP) pad surface finishes on bumpless...
Patent number
9,190,315
Issue date
Nov 17, 2015
Intel Corporation
Qinglei Zhang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Through mold via polymer block package
Patent number
8,450,857
Issue date
May 28, 2013
Intel Corporation
Mihir K. Roy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through mold via polymer block package
Patent number
8,278,214
Issue date
Oct 2, 2012
Intel Corporation
Mihir K. Roy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of enabling solder deposition on a substrate and electronic...
Patent number
7,825,022
Issue date
Nov 2, 2010
Intel Corporation
Ravi Nalla
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of enabling solder deposition on a substrate and electronic...
Patent number
7,538,429
Issue date
May 26, 2009
Intel Corporation
Ravi Nalla
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of substrate manufacture that decreases the package resistance
Patent number
7,432,202
Issue date
Oct 7, 2008
Intel Corporation
Bijay S. Saha
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
COMPARTMENT FOR MAGNET PLACEMENT
Publication number
20180095503
Publication date
Apr 5, 2018
Intel Corporation
Sandeep S. IYER
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
FLEXIBLE MICROELECTRONIC SYSTEMS AND METHODS OF FABRICATING THE SAME
Publication number
20150325491
Publication date
Nov 12, 2015
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSES OF MAKING PAD-LESS INTERCONNECT FOR ELECTRICAL CORELESS S...
Publication number
20150221608
Publication date
Aug 6, 2015
Intel Corporation
Javier SOTO GONZALEZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENABLING PACKAGE-ON-PACKAGE (POP) PAD SURFACE FINISHES ON BUMPLESS...
Publication number
20130320547
Publication date
Dec 5, 2013
Qinglei Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH MOLD VIA POLYMER BLOCK PACKAGE
Publication number
20120299179
Publication date
Nov 29, 2012
Mihir K. Roy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH MOLD VIA POLYMER BLOCK PACKAGE
Publication number
20110147929
Publication date
Jun 23, 2011
Mihir K. Roy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of enabling solder deposition on a substrate and electronic...
Publication number
20090277866
Publication date
Nov 12, 2009
Ravi Nalla
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of enabling solder deposition on a substrate and electronic...
Publication number
20080042248
Publication date
Feb 21, 2008
Ravi Nalla
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of providing solder bumps of mixed sizes on a substrate usin...
Publication number
20080003804
Publication date
Jan 3, 2008
Ravi Nalla
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of substrate manufacture that decreases the package resistance
Publication number
20070148971
Publication date
Jun 28, 2007
Bijay S. Saha
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR