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Charavanakumara Gurumurthy
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Gilbert, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Grid array connection device and method
Patent number
10,741,515
Issue date
Aug 11, 2020
Intel Corporation
Munehiro Toyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Grid array connection device and method
Patent number
10,373,924
Issue date
Aug 6, 2019
Intel Corporation
Munehiro Toyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder joints with enhanced electromigration resistance
Patent number
8,759,974
Issue date
Jun 24, 2014
Intel Corporation
Mengzhi Pang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multiple surface finishes for microelectronic package substrates
Patent number
8,461,036
Issue date
Jun 11, 2013
Intel Corporation
Tao Wu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solder joints with enhanced electromigration resistance
Patent number
8,013,444
Issue date
Sep 6, 2011
Intel Corporation
Mengzhi Pang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
GRID ARRAY CONNECTION DEVICE AND METHOD
Publication number
20190287937
Publication date
Sep 19, 2019
Intel Corporation
Munehiro Toyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GRID ARRAY CONNECTION DEVICE AND METHOD
Publication number
20180247908
Publication date
Aug 30, 2018
Intel Corporation
Munehiro Toyama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTROLYTIC GOLD OR GOLD PALLADIUM SURFACE FINISH APPLICATION IN C...
Publication number
20120077054
Publication date
Mar 29, 2012
Tao WU
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
MULTIPLE SURFACE FINISHES FOR MICROELECTRONIC PACKAGE SUBSTRATES
Publication number
20110147933
Publication date
Jun 23, 2011
Tao Wu
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR