Charles A. Gealer

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked-chip packages in package-on-package apparatus, methods of a...
- Patent number 11,217,516
- Issue date Jan 4, 2022
- Intel Corporation
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mainboard assembly including a package overlying a die directly att...
- Patent number 10,555,417
- Issue date Feb 4, 2020
- Intel Corporation
- Damion Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mainboard assembly including a package overlying a die directly att...
- Patent number 10,251,273
- Issue date Apr 2, 2019
- Intel Corporation
- Damion Searls
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Stacked-chip packages in package-on-package apparatus, methods of a...
- Patent number 10,186,480
- Issue date Jan 22, 2019
- Intel Corporation
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection of microelectronic devices
- Patent number 9,842,832
- Issue date Dec 12, 2017
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic assembly method
- Patent number 9,820,384
- Issue date Nov 14, 2017
- Intel Corporation
- Sasha Oster
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for solder for through-mold interconnect
- Patent number 9,666,549
- Issue date May 30, 2017
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for hermetic sealing of sensor chips and for their integ...
- Patent number 9,617,148
- Issue date Apr 11, 2017
- Intel Corporation
- Qing Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High density interconnection of microelectronic devices
- Patent number 9,397,071
- Issue date Jul 19, 2016
- Intel Corporation
- Omkar G. Karhade
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer for hermetic sealing of sensor chips and for their integ...
- Patent number 9,368,429
- Issue date Jun 14, 2016
- Intel Corporation
- Qing Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die assembly on thin dielectric sheet
- Patent number 9,177,831
- Issue date Nov 3, 2015
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall solders for through-mold interconnect
- Patent number 9,159,690
- Issue date Oct 13, 2015
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with dice landed on wire bonds
- Patent number 7,166,924
- Issue date Jan 23, 2007
- Intel Corporation
- Jicun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct BGA attachment without solder reflow
- Patent number 6,750,551
- Issue date Jun 15, 2004
- Intel Corporation
- Kristopher Frutschy
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
EMI containment for microprocessor core mounted on a card using sur...
- Patent number 6,239,973
- Issue date May 29, 2001
- Intel Corporation
- Scot W. Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
EMI containment for microprocessor core mounted on a card using sur...
- Patent number 6,043,983
- Issue date Mar 28, 2000
- Intel Corporation
- Scot W. Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface thickness control for a microprocessor
- Patent number 6,043,560
- Issue date Mar 28, 2000
- Intel Corporation
- Kevin J. Haley
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF A...
- Publication number 20190148275
- Publication date May 16, 2019
- Intel Corporation
- Sriram MUTHUKUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC ASSEMBLY METHOD
- Publication number 20180263117
- Publication date Sep 13, 2018
- Intel Corporation
- Sasha N. Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV-CONNECTED BACKSIDE DECOUPLING
- Publication number 20170012029
- Publication date Jan 12, 2017
- Intel Corporation
- William J. LAMBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES
- Publication number 20160300824
- Publication date Oct 13, 2016
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR HERMETIC SEALING OF SENSOR CHIPS AND FOR THEIR INTEG...
- Publication number 20160280539
- Publication date Sep 29, 2016
- Intel Corporation
- Qing MA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE ASSEMBLY ON THIN DIELECTRIC SHEET
- Publication number 20160043056
- Publication date Feb 11, 2016
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL SOLDERS FOR THROUGH-MOLD INTERCONNECT
- Publication number 20160043049
- Publication date Feb 11, 2016
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES
- Publication number 20150163904
- Publication date Jun 11, 2015
- Intel Corporation
- Omkar G. Karhade
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE ELECTRONIC ASSEMBLY AND METHOD
- Publication number 20150163921
- Publication date Jun 11, 2015
- Sasha Oster
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIE ASSEMBLY ON THIN DIELECTRIC SHEET
- Publication number 20150091182
- Publication date Apr 2, 2015
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL SOLDERS FOR THROUGH-MOLD INTERCONNECT
- Publication number 20150084192
- Publication date Mar 26, 2015
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR HERMETIC SEALING OF SENSOR CHIPS AND FOR THEIR INTEG...
- Publication number 20130249109
- Publication date Sep 26, 2013
- Qing MA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF A...
- Publication number 20130127054
- Publication date May 23, 2013
- Sriram MUTHUKUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked-chip packages in package-on-package apparatus, methods of a...
- Publication number 20100327419
- Publication date Dec 30, 2010
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mainboard assembly including a package overlying a die directly att...
- Publication number 20100061056
- Publication date Mar 11, 2010
- Damion Searls
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
INJECTION MOLDED METAL IC PACKAGE STIFFENER AND PACKAGE-TO-PACKAGE...
- Publication number 20090321925
- Publication date Dec 31, 2009
- Charles A. Gealer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic packages with dice landed on wire bonds
- Publication number 20060038273
- Publication date Feb 23, 2006
- Jicun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package overlay
- Publication number 20050121757
- Publication date Jun 9, 2005
- Charles A. Gealer
- H01 - BASIC ELECTRIC ELEMENTS

Charles A. Gealer

Person

Patents Grantslast 30 patents

Stacked-chip packages in package-on-package apparatus, methods of a...

Mainboard assembly including a package overlying a die directly att...

Mainboard assembly including a package overlying a die directly att...

Stacked-chip packages in package-on-package apparatus, methods of a...

High density interconnection of microelectronic devices

Flexible electronic assembly method

Methods for solder for through-mold interconnect

Interposer for hermetic sealing of sensor chips and for their integ...

High density interconnection of microelectronic devices

Interposer for hermetic sealing of sensor chips and for their integ...

Die assembly on thin dielectric sheet

Tall solders for through-mold interconnect

Electronic packages with dice landed on wire bonds

Direct BGA attachment without solder reflow

EMI containment for microprocessor core mounted on a card using sur...

EMI containment for microprocessor core mounted on a card using sur...

Thermal interface thickness control for a microprocessor

Patents Applicationslast 30 patents

STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF A...

FLEXIBLE ELECTRONIC ASSEMBLY METHOD

TSV-CONNECTED BACKSIDE DECOUPLING

HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES

INTERPOSER FOR HERMETIC SEALING OF SENSOR CHIPS AND FOR THEIR INTEG...

DIE ASSEMBLY ON THIN DIELECTRIC SHEET

TALL SOLDERS FOR THROUGH-MOLD INTERCONNECT

HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES

FLEXIBLE ELECTRONIC ASSEMBLY AND METHOD

DIE ASSEMBLY ON THIN DIELECTRIC SHEET

TALL SOLDERS FOR THROUGH-MOLD INTERCONNECT

INTERPOSER FOR HERMETIC SEALING OF SENSOR CHIPS AND FOR THEIR INTEG...

STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF A...

Stacked-chip packages in package-on-package apparatus, methods of a...

Mainboard assembly including a package overlying a die directly att...

INJECTION MOLDED METAL IC PACKAGE STIFFENER AND PACKAGE-TO-PACKAGE...

Electronic packages with dice landed on wire bonds

Integrated circuit package overlay