Charles A. Poutasse

Person

Cleveland, OH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Coatings for improved resin dust resistance
- Patent number 6,589,381
- Issue date Jul 8, 2003
- Gould Electronics, Inc.
- Charles A. Poutasse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coatings for improved resin dust resistance
- Patent number 6,299,721
- Issue date Oct 9, 2001
- Gould Electronics Incl
- Charles A. Poutasse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper coated polyimide with metallic protective layer
- Patent number 6,296,949
- Issue date Oct 2, 2001
- GA-TEK Inc.
- Tad Bergstresser
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminate for multi-layer printed circuit
- Patent number 6,268,070
- Issue date Jul 31, 2001
- Gould Electronics Inc.
- Tad Bergstresser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment of copper to prevent microcracking in flexible ci...
- Patent number 6,221,176
- Issue date Apr 24, 2001
- Gould Electronics, Inc.
- Harish D. Merchant
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive compositions and copper foils and copper clad laminates us...
- Patent number 6,132,851
- Issue date Oct 17, 2000
- GA-TEK Inc.
- Charles A. Poutasse
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesion promoting layer for use with epoxy prepregs
- Patent number 6,117,536
- Issue date Sep 12, 2000
- GA-TEK Inc.
- Charles A. Poutasse
- B32 - LAYERED PRODUCTS
Information Patent Grant
Epoxy adhesives and copper foils and copper clad laminates using same
- Patent number 5,629,098
- Issue date May 13, 1997
- Gould Electronics Inc.
- Charles A. Poutasse
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Foil with adhesion promoting layer derived from silane mixture
- Patent number 5,622,782
- Issue date Apr 22, 1997
- Gould Inc.
- Charles A. Poutasse
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multi-layer structures containing a silane adhesion promoting layer
- Patent number 5,614,324
- Issue date Mar 25, 1997
- Gould Electronics Inc.
- Charles A. Poutasse
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy adhesives and copper foils and copper clad laminates using same
- Patent number 5,525,433
- Issue date Jun 11, 1996
- Gould Electronics Inc.
- Charles A. Poutasse
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Coatings for improved resin dust resistance
- Publication number 20010015257
- Publication date Aug 23, 2001
- Charles A. Poutasse
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Charles A. Poutasse

Person

Patents Grantslast 30 patents

Coatings for improved resin dust resistance

Coatings for improved resin dust resistance

Copper coated polyimide with metallic protective layer

Laminate for multi-layer printed circuit

Surface treatment of copper to prevent microcracking in flexible ci...

Adhesive compositions and copper foils and copper clad laminates us...

Adhesion promoting layer for use with epoxy prepregs

Epoxy adhesives and copper foils and copper clad laminates using same

Foil with adhesion promoting layer derived from silane mixture

Multi-layer structures containing a silane adhesion promoting layer

Epoxy adhesives and copper foils and copper clad laminates using same

Patents Applicationslast 30 patents

Coatings for improved resin dust resistance