Charles B. Yates

Person

Princeton, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper foil and copper clad laminates for fabrication of multi-laye...
- Patent number 6,372,113
- Issue date Apr 16, 2002
- Yates Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil bonding treatment with improved bond strength and resis...
- Patent number 6,342,308
- Issue date Jan 29, 2002
- Yates Foil USA, Inc.
- Charles B. Yates
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin copper foil, and process and apparatus for the manufacture the...
- Patent number 6,291,080
- Issue date Sep 18, 2001
- Yates Foll USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Simplified process for production of roughened copper foil
- Patent number 6,270,645
- Issue date Aug 7, 2001
- Circuit Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process and apparatus for the manufacture of high peel-strength cop...
- Patent number 6,270,648
- Issue date Aug 7, 2001
- Yates Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for electrodeposition of barrier layer over copper foil bon...
- Patent number 6,224,991
- Issue date May 1, 2001
- Yates Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic copper foil having a modified shiny side
- Patent number 5,989,727
- Issue date Nov 23, 1999
- Circuit Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for the manufacture of high quality very low profile copper...
- Patent number 5,863,410
- Issue date Jan 26, 1999
- Circuit Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plural copper-layer treatment of copper foil and article made thereby
- Patent number RE30180
- Issue date Dec 25, 1979
- Yates Industries, Inc.
- Adam M. Wolski
- 428 - Stock material or miscellaneous articles
Information Patent Grant
Thin foil
- Patent number 3,998,601
- Issue date Dec 21, 1976
- Yates Industries, Inc.
- Charles B. Yates
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Process and apparatus for the manufacture of high peel-strength cop...
- Publication number 20020023844
- Publication date Feb 28, 2002
- Yates Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL AND COPPER CLAD LAMINATES FOR FABRICATION OF MULTI-LAYE...
- Publication number 20010051282
- Publication date Dec 13, 2001
- Yates Foil USA, Inc.
- CHARLES B. YATES
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Charles B. Yates

Person

Patents Grantslast 30 patents

Copper foil and copper clad laminates for fabrication of multi-laye...

Copper foil bonding treatment with improved bond strength and resis...

Thin copper foil, and process and apparatus for the manufacture the...

Simplified process for production of roughened copper foil

Process and apparatus for the manufacture of high peel-strength cop...

Process for electrodeposition of barrier layer over copper foil bon...

Electrolytic copper foil having a modified shiny side

Process for the manufacture of high quality very low profile copper...

Plural copper-layer treatment of copper foil and article made thereby

Thin foil

Patents Applicationslast 30 patents

Process and apparatus for the manufacture of high peel-strength cop...

COPPER FOIL AND COPPER CLAD LAMINATES FOR FABRICATION OF MULTI-LAYE...