CHARLES C. GOLDSMITH

Person

HOPEWELL JUNCTION, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electromigration-resistant lead-free solder interconnect structures
- Patent number 9,379,007
- Issue date Jun 28, 2016
- Globalfoundries Inc.
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress locking layer for reliable metallization
- Patent number 8,420,537
- Issue date Apr 16, 2013
- International Business Machines Corporation
- Kaushik Chanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to gain substantial reliability improvements i...
- Patent number 7,875,806
- Issue date Jan 25, 2011
- International Business Machines Corporation
- Muta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method to gain substantial reliability improvements i...
- Patent number 7,731,077
- Issue date Jun 8, 2010
- International Business Machines Corporation
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method to gain substantial reliability improvements i...
- Patent number 7,287,685
- Issue date Oct 30, 2007
- International Business Machines Corporation
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Immersion plating and plated structures
- Patent number 7,276,296
- Issue date Oct 2, 2007
- International Business Machines Corporation
- Emanuel I. Cooper
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Immersion plating and plated structures
- Patent number 7,037,559
- Issue date May 2, 2006
- International Business Machines Corporation
- Emanuel I. Cooper
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lead-free tin-silver-copper alloy solder composition
- Patent number 6,805,974
- Issue date Oct 19, 2004
- International Business Machines Corporation
- Won K. Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device produced by a process of controlling grain growth in metal f...
- Patent number 6,638,374
- Issue date Oct 28, 2003
- International Business Machines Corporation
- Patrick W. DeHaven
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of controlling grain growth in metal films
- Patent number 6,361,627
- Issue date Mar 26, 2002
- International Business Machines Corporation
- Patrick W. DeHaven
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process of controlling grain growth in metal films
- Patent number 6,126,761
- Issue date Oct 3, 2000
- International Business Machines Corporation
- Patrick W. DeHaven
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for producing a low-stress electrolessly deposited nickel layer
- Patent number 5,876,795
- Issue date Mar 2, 1999
- International Business Machines Corporation
- Charles Curtis Goldsmith
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
- Publication number 20130249066
- Publication date Sep 26, 2013
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
- Publication number 20130252418
- Publication date Sep 26, 2013
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO GAIN SUBSTANTIAL RELIABILITY IMPROVEMENTS I...
- Publication number 20100139958
- Publication date Jun 10, 2010
- International Business Machines Corporation
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stress Locking Layer for Reliable Metallization
- Publication number 20090297759
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Kaushik Chanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO GAIN SUBSTANTIAL RELIABILITY IMPROVEMENTS I...
- Publication number 20070228117
- Publication date Oct 4, 2007
- International Business Machines Corporation
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND METHOD TO GAIN SUBSTANTIAL RELIABILITY IMPROVEMENTS I...
- Publication number 20060060638
- Publication date Mar 23, 2006
- International Business Machines Corporation
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Immersion plating and plated structures
- Publication number 20050238906
- Publication date Oct 27, 2005
- International Business Machines Corporation
- Emanuel I. Cooper
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY
- Publication number 20050104208
- Publication date May 19, 2005
- International Business Machines Corporation
- James C. Bartelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Immersion plating and plated structures
- Publication number 20040219384
- Publication date Nov 4, 2004
- International Business Machines Corporation
- Emanuel I. Cooper
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Lead-free tin-silver-copper alloy solder composition
- Publication number 20030156969
- Publication date Aug 21, 2003
- International Business Machines Corporation
- Won K. Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device produced by a process of controlling grain growth in metal f...
- Publication number 20020129879
- Publication date Sep 19, 2002
- Patrick W. DeHaven
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

CHARLES C. GOLDSMITH

Person

Patents Grantslast 30 patents

Electromigration-resistant lead-free solder interconnect structures

Stress locking layer for reliable metallization

Structure and method to gain substantial reliability improvements i...

Structure and method to gain substantial reliability improvements i...

Structure and method to gain substantial reliability improvements i...

Immersion plating and plated structures

Immersion plating and plated structures

Lead-free tin-silver-copper alloy solder composition

Device produced by a process of controlling grain growth in metal f...

Process of controlling grain growth in metal films

Process of controlling grain growth in metal films

Method for producing a low-stress electrolessly deposited nickel layer

Patents Applicationslast 30 patents

ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES

ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES

STRUCTURE AND METHOD TO GAIN SUBSTANTIAL RELIABILITY IMPROVEMENTS I...

Stress Locking Layer for Reliable Metallization

STRUCTURE AND METHOD TO GAIN SUBSTANTIAL RELIABILITY IMPROVEMENTS I...

STRUCTURE AND METHOD TO GAIN SUBSTANTIAL RELIABILITY IMPROVEMENTS I...

Immersion plating and plated structures

STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY

Immersion plating and plated structures

Lead-free tin-silver-copper alloy solder composition

Device produced by a process of controlling grain growth in metal f...