Charles Carpenter

Person

Orlando, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Surface acoustic wave (SAW) device with antireflective structure
- Patent number 10,924,086
- Issue date Feb 16, 2021
- Qorvo US, Inc.
- Marc Solal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure encapsulant for size-reduced semiconductor package
- Patent number 9,646,857
- Issue date May 9, 2017
- Qorvo US, Inc.
- Howard Terry Glascock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic wave device
- Patent number 9,209,380
- Issue date Dec 8, 2015
- TriQuint Semiconductor, Inc.
- Suzanne Combe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Stud bumps for die alignment
- Patent number 7,880,287
- Issue date Feb 1, 2011
- TriQuint Semiconductor, Inc.
- Bruno Samuel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a wafer-level package filter
- Patent number 7,596,849
- Issue date Oct 6, 2009
- Triquint Semiconductor, Inc.
- Charles Carpenter
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer-level surface acoustic wave filter package with temperature-c...
- Patent number 7,230,512
- Issue date Jun 12, 2007
- Triquint, Inc.
- Charles Carpenter
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for array processing of surface acoustic wave devices
- Patent number 6,928,718
- Issue date Aug 16, 2005
- Sawtekk, Inc.
- Charles Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-acoustic-wave pressure sensor and associated methods
- Patent number 6,571,638
- Issue date Jun 3, 2003
- Sawtek, Inc.
- Jacqueline Hines
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
COMPARTMENTALIZED SHIELDING OF A MODULE UTILIZING SELF-SHIELDED SUB...
- Publication number 20230247814
- Publication date Aug 3, 2023
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH SOLDER INTERCONNECT AND MULTIPLE MATERIAL EN...
- Publication number 20220052667
- Publication date Feb 17, 2022
- Qorvo US, Inc.
- Charles E. Carpenter
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SURFACE ACOUSTIC WAVE (SAW) DEVICE WITH ANTIREFLECTIVE STRUCTURE
- Publication number 20180109242
- Publication date Apr 19, 2018
- Qorvo US, Inc.
- Marc Solal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PRESSURE ENCAPSULANT FOR SIZE-REDUCED SEMICONDUCTOR PACKAGE
- Publication number 20170047232
- Publication date Feb 16, 2017
- Qorvo US, Inc.
- Howard Terry Glascock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC WAVE DEVICE
- Publication number 20140252916
- Publication date Sep 11, 2014
- TriQuint Semiconductor, Inc.
- Suzanne Combe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL PACKAGE AND MANUFACTURING METHOD
- Publication number 20130087379
- Publication date Apr 11, 2013
- TriQuint Semiconductor, Inc.
- George Grama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Package and Manufacturing Method Using Photodefinable P...
- Publication number 20120094418
- Publication date Apr 19, 2012
- TriQuint Semiconductor, Inc.
- George Grama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Surface-acoustic-wave pressure sensor and associated methods
- Publication number 20020078757
- Publication date Jun 27, 2002
- Jacqueline Hines
- B60 - VEHICLES IN GENERAL
Information Patent Application
System and method for array processing of surface acoustic wave dev...
- Publication number 20020008438
- Publication date Jan 24, 2002
- Charles Carpenter
- H01 - BASIC ELECTRIC ELEMENTS

Charles Carpenter

Person

Patents Grantslast 30 patents

Surface acoustic wave (SAW) device with antireflective structure

Low pressure encapsulant for size-reduced semiconductor package

Acoustic wave device

Stud bumps for die alignment

Method of assembling a wafer-level package filter

Wafer-level surface acoustic wave filter package with temperature-c...

Method for array processing of surface acoustic wave devices

Surface-acoustic-wave pressure sensor and associated methods

Patents Applicationslast 30 patents

COMPARTMENTALIZED SHIELDING OF A MODULE UTILIZING SELF-SHIELDED SUB...

ELECTRONIC DEVICE WITH SOLDER INTERCONNECT AND MULTIPLE MATERIAL EN...

SURFACE ACOUSTIC WAVE (SAW) DEVICE WITH ANTIREFLECTIVE STRUCTURE

LOW PRESSURE ENCAPSULANT FOR SIZE-REDUCED SEMICONDUCTOR PACKAGE

ACOUSTIC WAVE DEVICE

HIGH RELIABILITY WAFER LEVEL PACKAGE AND MANUFACTURING METHOD

Wafer Level Package and Manufacturing Method Using Photodefinable P...

Surface-acoustic-wave pressure sensor and associated methods

System and method for array processing of surface acoustic wave dev...