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Charles E. Gasdik
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Endicott, NY, US
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last 30 patents
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Patent Grant
Copper plating bath having increased plating rate, and method
Patent number
4,540,473
Issue date
Sep 10, 1985
International Business Machines Corporation
Perminder S. Bindra
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR