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Charles F. Carey
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Endicott, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor chip used in flip chip process
Patent number
7,851,911
Issue date
Dec 14, 2010
International Business Machines Corporation
Charles F. Carey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Monitoring cool-down stress in a flip chip process using monitor so...
Patent number
7,674,637
Issue date
Mar 9, 2010
International Business Machines Corporation
Charles F. Carey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Extension of fatigue life for C4 solder ball to chip connection
Patent number
7,119,003
Issue date
Oct 10, 2006
International Business Machines Corporation
William E. Bernier
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Extension of fatigue life for C4 solder ball to chip connection
Patent number
7,067,916
Issue date
Jun 27, 2006
International Business Machines Corporation
William E. Bernier
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package for electronic component
Patent number
6,677,522
Issue date
Jan 13, 2004
International Business Machines Corporation
Charles F. Carey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for selective application of solder to circuit packages
Patent number
5,672,260
Issue date
Sep 30, 1997
International Business Machines Corporation
Charles Francis Carey
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electroplating apparatus
Patent number
5,656,139
Issue date
Aug 12, 1997
International Business Machines Corporation
Charles Francis Carey
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Process for selective application of solder to circuit packages
Patent number
5,597,469
Issue date
Jan 28, 1997
International Business Machines Corporation
Charles F. Carey
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Low temperature controlled collapse chip attach process
Patent number
5,075,965
Issue date
Dec 31, 1991
International Business Machines
Charles F. Carey
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR CHIP USED IN FLIP CHIP PROCESS
Publication number
20100155943
Publication date
Jun 24, 2010
International Business Machines Corporation
Charles F. Carey
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Monitoring Cool-Down Stress in a Flip Chip Process Using Monitor So...
Publication number
20080286886
Publication date
Nov 20, 2008
Charles F. Carey
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Extension of fatigue life for C4 solder ball to chip connection
Publication number
20050224973
Publication date
Oct 13, 2005
William E. Bernier
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Extension of fatigue life for C4 solder ball to chip connection
Publication number
20020195707
Publication date
Dec 26, 2002
International Business Machines Corporation
William E. Bernier
H01 - BASIC ELECTRIC ELEMENTS