Charles G. Bigler

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for making an electronic component having an organic substrate
- Patent number 5,691,242
- Issue date Nov 25, 1997
- Motorola, Inc.
- Victor K. Nomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded carrier ring leadframe having a particular resin injecting a...
- Patent number 5,517,056
- Issue date May 14, 1996
- Motorola, Inc.
- Charles G. Bigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a lead-on-chip semiconductor device having periph...
- Patent number 5,455,200
- Issue date Oct 3, 1995
- Motorola, Inc.
- Charles G. Bigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-on chip semiconductor device having peripheral bond pads
- Patent number 5,381,036
- Issue date Jan 10, 1995
- Motorola, Inc.
- Charles G. Bigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TAB bonded semiconductor device having off-chip power and ground di...
- Patent number 5,060,052
- Issue date Oct 22, 1991
- Motorola, Inc.
- James J. Casto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package with peripheral carrier structure of low-...
- Patent number 4,897,602
- Issue date Jan 30, 1990
- Motorola, Inc.
- Paul T. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of making an electronic device package with peripheral carr...
- Patent number 4,837,184
- Issue date Jun 6, 1989
- Motorola Inc.
- Paul T. Lin
- H01 - BASIC ELECTRIC ELEMENTS

Charles G. Bigler

Person

Patents Grantslast 30 patents

Method for making an electronic component having an organic substrate

Molded carrier ring leadframe having a particular resin injecting a...

Method for making a lead-on-chip semiconductor device having periph...

Lead-on chip semiconductor device having peripheral bond pads

TAB bonded semiconductor device having off-chip power and ground di...

Electronic device package with peripheral carrier structure of low-...

Process of making an electronic device package with peripheral carr...