Charles H. Perry

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Self-scrub buckling beam probe
- Patent number 6,529,021
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Yuet-Ying Yu
- G01 - MEASURING TESTING
Information Patent Grant
Metal buckling beam probe
- Patent number 6,404,211
- Issue date Jun 11, 2002
- International Business Machines Corporation
- Harvey C. Hamel
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer test and burn-in
- Patent number 6,351,134
- Issue date Feb 26, 2002
- International Business Machines Corporation
- James Marc Leas
- G01 - MEASURING TESTING
Information Patent Grant
Segmented architecture for wafer test and burn-in
- Patent number 6,275,051
- Issue date Aug 14, 2001
- International Business Machines Corporation
- Thomas W. Bachelder
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for the testing of plastically deformable objects
- Patent number 6,038,931
- Issue date Mar 21, 2000
- International Business Machines Corporation
- David C. Long
- G01 - MEASURING TESTING
Information Patent Grant
Wafer test and burn-in platform using ceramic tile supports
- Patent number 6,020,750
- Issue date Feb 1, 2000
- International Business Machines Corporation
- Daniel George Berger
- G01 - MEASURING TESTING
Information Patent Grant
Large area multiple-chip probe assembly and method of making the same
- Patent number 5,977,787
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Gobina Das
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer test and burn-in
- Patent number 5,929,651
- Issue date Jul 27, 1999
- International Business Machines Corporation
- James Marc Leas
- G01 - MEASURING TESTING
Information Patent Grant
Interface card for a probe card assembly
- Patent number 5,629,631
- Issue date May 13, 1997
- International Business Machines Corporation
- Charles H. Perry
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer test and burn-in
- Patent number 5,600,257
- Issue date Feb 4, 1997
- International Business Machines Corporation
- James M. Leas
- G01 - MEASURING TESTING
Information Patent Grant
Probe card assembly having a ceramic probe card
- Patent number 5,546,012
- Issue date Aug 13, 1996
- International Business Machines Corporation
- Charles H. Perry
- G01 - MEASURING TESTING
Information Patent Grant
Ceramic probe card and method for reducing leakage current
- Patent number 5,532,608
- Issue date Jul 2, 1996
- International Business Machines Corporation
- Abbas Behfar-Rad
- G01 - MEASURING TESTING
Information Patent Grant
Probe card assembly
- Patent number 5,530,371
- Issue date Jun 25, 1996
- International Business Machines Corporation
- Charles H. Perry
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER TEST AND BURN-IN
- Publication number 20020003432
- Publication date Jan 10, 2002
- JAMES MARC LEAS
- G01 - MEASURING TESTING
Information Patent Application
Segmented architecture for wafer test & burn-in
- Publication number 20010050567
- Publication date Dec 13, 2001
- International Business Machines Corporation
- Thomas W. Bachelder
- G01 - MEASURING TESTING
Information Patent Application
METAL BUCKLING BEAM PROBE
- Publication number 20010011897
- Publication date Aug 9, 2001
- HARVEY C. HAMEL
- G01 - MEASURING TESTING

Charles H. Perry

Person

Patents Grantslast 30 patents

Self-scrub buckling beam probe

Metal buckling beam probe

Semiconductor wafer test and burn-in

Segmented architecture for wafer test and burn-in

Method and apparatus for the testing of plastically deformable objects

Wafer test and burn-in platform using ceramic tile supports

Large area multiple-chip probe assembly and method of making the same

Semiconductor wafer test and burn-in

Interface card for a probe card assembly

Semiconductor wafer test and burn-in

Probe card assembly having a ceramic probe card

Ceramic probe card and method for reducing leakage current

Probe card assembly

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER TEST AND BURN-IN

Segmented architecture for wafer test & burn-in

METAL BUCKLING BEAM PROBE