Charles J Vath, III

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Capillary for wire bonding
- Patent number 7,427,009
- Issue date Sep 23, 2008
- ASM Technology Singapore Pte. Ltd.
- Loon A Lim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR