TREA

Charles J. Vath III

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  • Singapore, SG
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Patents Grantslast 30 patents

  • Information Patent Grant

    Mold and method for encapsulation of electronic device
    • Patent number 6,770,163
    • Issue date Aug 3, 2004
    • ASM Technology Singapore Pte. Ltd.
    • Teng Hock Kuah
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Mold for a semiconductor chip
    • Patent number 6,674,165
    • Issue date Jan 6, 2004
    • ASM Technology Singapore Pte. Ltd.
    • Shu Chuen Ho
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRE BONDING PROCESS FOR INSULATED WIRES
    • Publication number 20070262119
    • Publication date Nov 15, 2007
    • Malliah Ramkumar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Capillary for wire bonding
    • Publication number 20050284913
    • Publication date Dec 29, 2005
    • ASM Technology Singapore Pte Ltd
    • Loon Aik Lim
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Mold
    • Publication number 20030034555
    • Publication date Feb 20, 2003
    • ASM Technology Singapore Pte Ltd
    • Shu Chuen Ho
    • H01 - BASIC ELECTRIC ELEMENTS