Charles L. Arvin

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
High bandwidth module
- Patent number 11,756,930
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Near tier decoupling capacitors
- Patent number 11,694,992
- Issue date Jul 4, 2023
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer for die-to-die communication in an integrated circuit and me...
- Patent number 11,521,952
- Issue date Dec 6, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polygon integrated circuit (IC) packaging
- Patent number 11,410,894
- Issue date Aug 9, 2022
- International Business Machines Corporation
- Charles L. Arvin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Direct attachment of capacitors to flip chip dies
- Patent number 11,404,365
- Issue date Aug 2, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment carrier for interconnect bridge assembly
- Patent number 11,393,759
- Issue date Jul 19, 2022
- International Business Machines Corporation
- Thomas Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitors for core and adjacent build up layers
- Patent number 11,388,821
- Issue date Jul 12, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enlarged conductive pad structures for enhanced chip bond assembly...
- Patent number 11,282,773
- Issue date Mar 22, 2022
- International Business Machines Corporation
- Krishna R. Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 11,270,964
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Personalized copper block for selective solder removal
- Patent number 11,235,404
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Charles L. Arvin
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Mitigating thermal-mechanical strain and warpage of an organic lami...
- Patent number 11,239,183
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth module
- Patent number 11,201,136
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deionized-water cooling for electrical equipment
- Patent number 11,180,398
- Issue date Nov 23, 2021
- International Business Machines Corporation
- Prabjit Singh
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Direct bonded heterogeneous integration packaging structures
- Patent number 11,177,217
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of terminal metallurgy on laminates and boards
- Patent number 11,168,400
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit (IC) device package lid attach utilizing nano pa...
- Patent number 11,164,804
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized catalyst for enhanced thermal interface material heat tra...
- Patent number 11,152,282
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip packaging rework
- Patent number 11,121,101
- Issue date Sep 14, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for treating solution for use in electroplating application...
- Patent number 11,053,604
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 11,043,468
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer for die-to-die communication in an integrated circuit
- Patent number 11,031,373
- Issue date Jun 8, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fins for enhanced die communication
- Patent number 11,031,343
- Issue date Jun 8, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit tester probe contact liner
- Patent number 11,009,545
- Issue date May 18, 2021
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked capacitors for use in integrated circuit modules and the like
- Patent number 11,004,614
- Issue date May 11, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer system with modified module socket
- Patent number 10,993,324
- Issue date Apr 27, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge support structure
- Patent number 10,957,650
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical cleaning of test probes
- Patent number 10,955,439
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Charles L. Arvin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lead-free column interconnect
- Patent number 10,950,573
- Issue date Mar 16, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip carrier for bridge assembly
- Patent number 10,916,507
- Issue date Feb 9, 2021
- International Business Machines Corporation
- Charles L Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevent and remove organics from reservoir wells
- Patent number 10,895,017
- Issue date Jan 19, 2021
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE WITH VARYING INTERCONNECTS
- Publication number 20230197658
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Kamal K. SIKKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEAR TIER DECOUPLING CAPACITORS
- Publication number 20220271005
- Publication date Aug 25, 2022
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH MODULE
- Publication number 20220059499
- Publication date Feb 24, 2022
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENLARGED CONDUCTIVE PAD STRUCTURES FOR ENHANCED CHIP BOND ASSEMBLY...
- Publication number 20210320056
- Publication date Oct 14, 2021
- International Business Machines Corporation
- Krishna R. Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERSONALIZED COPPER BLOCK FOR SELECTIVE SOLDER REMOVAL
- Publication number 20210291287
- Publication date Sep 23, 2021
- International Business Machines Corporation
- Charles L. Arvin
- B22 - CASTING POWDER METALLURGY
Information Patent Application
HIGH BANDWIDTH MODULE
- Publication number 20210288025
- Publication date Sep 16, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING THERMAL-MECHANICAL STRAIN AND WARPAGE OF AN ORGANIC LAMI...
- Publication number 20210242139
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGING REWORK
- Publication number 20210242146
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CORNER GUARD FOR CHIP-PACKAGE INTERACTION FAILURE MITIGATION
- Publication number 20210233824
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT
- Publication number 20210175207
- Publication date Jun 10, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT CARRIER FOR INTERCONNECT BRIDGE ASSEMBLY
- Publication number 20210104464
- Publication date Apr 8, 2021
- International Business Machines Corporation
- Thomas Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYGON INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20210074599
- Publication date Mar 11, 2021
- International Business Machines Corporation
- Charles L. Arvin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BRIDGE SUPPORT STRUCTURE
- Publication number 20210057341
- Publication date Feb 25, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit (IC) Device Package Lid Attach Utilizing Nano Pa...
- Publication number 20210028079
- Publication date Jan 28, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER SYSTEM WITH MODIFIED MODULE SOCKET
- Publication number 20200412045
- Publication date Dec 31, 2020
- International Business Machines Corporation
- Charles Leon Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FINS FOR ENHANCED DIE COMMUNICATION
- Publication number 20200402912
- Publication date Dec 24, 2020
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEIONIZED-WATER COOLING FOR ELECTRICAL EQUIPMENT
- Publication number 20200392026
- Publication date Dec 17, 2020
- International Business Machines Corporation
- Prabjit Singh
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Application
DIRECT ATTACHMENT OF CAPACITORS TO FLIP CHIP DIES
- Publication number 20200357737
- Publication date Nov 12, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT
- Publication number 20200312812
- Publication date Oct 1, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE COLUMN INTERCONNECT
- Publication number 20200303339
- Publication date Sep 24, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINNED CONTACT
- Publication number 20200294946
- Publication date Sep 17, 2020
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCHEMICAL CLEANING OF TEST PROBES
- Publication number 20200292577
- Publication date Sep 17, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECISION ALIGNMENT OF MULTI-CHIP HIGH DENSITY INTERCONNECTS
- Publication number 20200243479
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITORS FOR CORE AND ADJACENT BUILD UP LAYERS
- Publication number 20200245466
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT TESTER PROBE CONTACT LINER
- Publication number 20200209308
- Publication date Jul 2, 2020
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED CAPACITORS FOR USE IN INTEGRATED CIRCUIT MODULES AND THE LIKE
- Publication number 20200185156
- Publication date Jun 11, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE CHIP CARRIER FOR BRIDGE ASSEMBLY
- Publication number 20200176383
- Publication date Jun 4, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20200161272
- Publication date May 21, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES
- Publication number 20200144187
- Publication date May 7, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-POROUS COPPER TO COPPER INTERCONNECT
- Publication number 20200098723
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS

Charles L. Arvin

Person

Patents Grantslast 30 patents

High bandwidth module

Near tier decoupling capacitors

Spacer for die-to-die communication in an integrated circuit and me...

Polygon integrated circuit (IC) packaging

Direct attachment of capacitors to flip chip dies

Alignment carrier for interconnect bridge assembly

Thin film capacitors for core and adjacent build up layers

Enlarged conductive pad structures for enhanced chip bond assembly...

Mixed UBM and mixed pitch on a single die

Personalized copper block for selective solder removal

Mitigating thermal-mechanical strain and warpage of an organic lami...

High bandwidth module

Deionized-water cooling for electrical equipment

Direct bonded heterogeneous integration packaging structures

Formation of terminal metallurgy on laminates and boards

Integrated circuit (IC) device package lid attach utilizing nano pa...

Localized catalyst for enhanced thermal interface material heat tra...

Flip chip packaging rework

System for treating solution for use in electroplating application...

Lead-free solder joining of electronic structures

Spacer for die-to-die communication in an integrated circuit

Fins for enhanced die communication

Integrated circuit tester probe contact liner

Stacked capacitors for use in integrated circuit modules and the like

Computer system with modified module socket

Bridge support structure

Electrochemical cleaning of test probes

Lead-free column interconnect

Multiple chip carrier for bridge assembly

Prevent and remove organics from reservoir wells

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE WITH VARYING INTERCONNECTS

NEAR TIER DECOUPLING CAPACITORS

HIGH BANDWIDTH MODULE

ENLARGED CONDUCTIVE PAD STRUCTURES FOR ENHANCED CHIP BOND ASSEMBLY...

PERSONALIZED COPPER BLOCK FOR SELECTIVE SOLDER REMOVAL

HIGH BANDWIDTH MODULE

MITIGATING THERMAL-MECHANICAL STRAIN AND WARPAGE OF AN ORGANIC LAMI...

FLIP CHIP PACKAGING REWORK

CHIP CORNER GUARD FOR CHIP-PACKAGE INTERACTION FAILURE MITIGATION

SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT

ALIGNMENT CARRIER FOR INTERCONNECT BRIDGE ASSEMBLY

POLYGON INTEGRATED CIRCUIT (IC) PACKAGING

BRIDGE SUPPORT STRUCTURE

Integrated Circuit (IC) Device Package Lid Attach Utilizing Nano Pa...

COMPUTER SYSTEM WITH MODIFIED MODULE SOCKET

FINS FOR ENHANCED DIE COMMUNICATION

DEIONIZED-WATER COOLING FOR ELECTRICAL EQUIPMENT

DIRECT ATTACHMENT OF CAPACITORS TO FLIP CHIP DIES

SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT

LEAD-FREE COLUMN INTERCONNECT

FINNED CONTACT

ELECTROCHEMICAL CLEANING OF TEST PROBES

PRECISION ALIGNMENT OF MULTI-CHIP HIGH DENSITY INTERCONNECTS

THIN FILM CAPACITORS FOR CORE AND ADJACENT BUILD UP LAYERS

INTEGRATED CIRCUIT TESTER PROBE CONTACT LINER

STACKED CAPACITORS FOR USE IN INTEGRATED CIRCUIT MODULES AND THE LIKE

MULTIPLE CHIP CARRIER FOR BRIDGE ASSEMBLY

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES

NON-POROUS COPPER TO COPPER INTERCONNECT