Charles L. Reynolds

Person

Red Hook, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thin film capacitors for core and adjacent build up layers
- Patent number 11,388,821
- Issue date Jul 12, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and integrated memory
- Patent number 10,892,249
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and integrated memory
- Patent number 10,840,214
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit using metal layers as a moisture diffusion barr...
- Patent number 10,813,215
- Issue date Oct 20, 2020
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit using metal layers as a moisture diffusion barr...
- Patent number 10,806,030
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor stiffener
- Patent number 10,756,031
- Issue date Aug 25, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit using metal layers as a moisture diffusion barr...
- Patent number 10,687,420
- Issue date Jun 16, 2020
- International Business Machines Corporation
- Jean Audet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,679,931
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitors for core and adjacent build up layers
- Patent number 10,660,209
- Issue date May 19, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi terminal capacitor within input output path of semiconductor...
- Patent number 10,622,299
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier and integrated memory
- Patent number 10,515,929
- Issue date Dec 24, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and integrated memory
- Patent number 10,431,563
- Issue date Oct 1, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,249,559
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Jae-Woong Nah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi terminal capacitor within input output path of semiconductor...
- Patent number 10,224,273
- Issue date Mar 5, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi terminal capacitor within input output path of semiconductor...
- Patent number 10,224,274
- Issue date Mar 5, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi terminal capacitor within input output path of semiconductor...
- Patent number 9,899,313
- Issue date Feb 20, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 9,263,378
- Issue date Feb 16, 2016
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module system with removable socketed modules
- Patent number 8,680,670
- Issue date Mar 25, 2014
- International Business Machines Corporation
- Jon Alfred Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-destructive low melt test for off-composition solder
- Patent number 6,016,947
- Issue date Jan 25, 2000
- International Business Machines Corporation
- Timothy W. Donahue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structurally reinforced ball grid array semiconductor package and s...
- Patent number 5,796,169
- Issue date Aug 18, 1998
- International Business Machines Corporation
- Robert Charles Dockerty
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTICOMPONENT MODULE DESIGN AND FABRICATION
- Publication number 20220308564
- Publication date Sep 29, 2022
- International Business Machines Corporation
- Kirk D. Peterson
- G05 - CONTROLLING REGULATING
Information Patent Application
THIN FILM CAPACITORS FOR CORE AND ADJACENT BUILD UP LAYERS
- Publication number 20200245466
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND INTEGRATED MEMORY
- Publication number 20190378816
- Publication date Dec 12, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND INTEGRATED MEMORY
- Publication number 20190312009
- Publication date Oct 10, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND INTEGRATED MEMORY
- Publication number 20190312011
- Publication date Oct 10, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND INTEGRATED MEMORY
- Publication number 20190312010
- Publication date Oct 10, 2019
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...
- Publication number 20190229045
- Publication date Jul 25, 2019
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR...
- Publication number 20190172784
- Publication date Jun 6, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITORS FOR CORE AND ADJACENT BUILD UP LAYERS
- Publication number 20190150287
- Publication date May 16, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR...
- Publication number 20180068945
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR...
- Publication number 20180053717
- Publication date Feb 22, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR...
- Publication number 20180012838
- Publication date Jan 11, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARR...
- Publication number 20160211481
- Publication date Jul 21, 2016
- Kyocera Circuit Solutions Inc.
- Jean AUDET
- G01 - MEASURING TESTING
Information Patent Application
MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARR...
- Publication number 20160211229
- Publication date Jul 21, 2016
- Kyocera Circuit Solutions Inc.
- Jean AUDET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARR...
- Publication number 20160210398
- Publication date Jul 21, 2016
- Kyocera Circuit Solutions Inc.
- Jean AUDET
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...
- Publication number 20160133554
- Publication date May 12, 2016
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...
- Publication number 20160035659
- Publication date Feb 4, 2016
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES
- Publication number 20120098116
- Publication date Apr 26, 2012
- International Business Machines Corporation
- Jon Alfred Casey
- H01 - BASIC ELECTRIC ELEMENTS

Charles L. Reynolds

Person

Patents Grantslast 30 patents

Thin film capacitors for core and adjacent build up layers

Carrier and integrated memory

Carrier and integrated memory

Multi-layer circuit using metal layers as a moisture diffusion barr...

Multi-layer circuit using metal layers as a moisture diffusion barr...

Decoupling capacitor stiffener

Multi-layer circuit using metal layers as a moisture diffusion barr...

Ball grid array and land grid array assemblies fabricated using tem...

Thin film capacitors for core and adjacent build up layers

Multi terminal capacitor within input output path of semiconductor...

Carrier and integrated memory

Carrier and integrated memory

Ball grid array and land grid array assemblies fabricated using tem...

Multi terminal capacitor within input output path of semiconductor...

Multi terminal capacitor within input output path of semiconductor...

Multi terminal capacitor within input output path of semiconductor...

Ball grid array and land grid array assemblies fabricated using tem...

Multi-chip module system with removable socketed modules

Non-destructive low melt test for off-composition solder

Structurally reinforced ball grid array semiconductor package and s...

Patents Applicationslast 30 patents

MULTICOMPONENT MODULE DESIGN AND FABRICATION

THIN FILM CAPACITORS FOR CORE AND ADJACENT BUILD UP LAYERS

CARRIER AND INTEGRATED MEMORY

CARRIER AND INTEGRATED MEMORY

CARRIER AND INTEGRATED MEMORY

CARRIER AND INTEGRATED MEMORY

BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...

MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR...

THIN FILM CAPACITORS FOR CORE AND ADJACENT BUILD UP LAYERS

MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR...

MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR...

MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR...

MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARR...

MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARR...

MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARR...

BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...

BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...

MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES