Charles Rimbert-Riviere

Person

Soest, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Transport system
- Patent number 11,217,467
- Issue date Jan 4, 2022
- Infineon Technologies AG
- Michael Daginnus-Metzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded package with chip carrier comprising brazed electrically con...
- Patent number 10,283,432
- Issue date May 7, 2019
- Infineon Technologies AG
- Mark Pavier
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Selecting a substrate to be soldered to a carrier
- Patent number 10,141,199
- Issue date Nov 27, 2018
- Infineon Technologies AG
- Charles Rimbert-Riviere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded package with chip carrier comprising brazed electrically con...
- Patent number 10,074,590
- Issue date Sep 11, 2018
- Infineon Technologies AG
- Mark Pavier
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE BARCODE READABILITY ENHANCEMENT STRUCTURES AND METHOD
- Publication number 20240339416
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Charles Rimbert-Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE
- Publication number 20240290707
- Publication date Aug 29, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Höhn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Power Module with Crack Sensing
- Publication number 20240170347
- Publication date May 23, 2024
- INFINEON TECHNOLOGIES AG
- Charles Rimbert-Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEPARATING SUBSTRATES
- Publication number 20220355418
- Publication date Nov 10, 2022
- Charles Rimbert-Riviere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR SUBSTRATE ARRANGEMENT
- Publication number 20210305062
- Publication date Sep 30, 2021
- Charles Rimbert-Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transport System
- Publication number 20210111049
- Publication date Apr 15, 2021
- Michael Daginnus-Metzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded package with chip carrier comprising brazed electrically con...
- Publication number 20190006260
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Mark PAVIER
- B60 - VEHICLES IN GENERAL
Information Patent Application
Method for Soldering an Insulating Substrate onto a Carrier
- Publication number 20170062241
- Publication date Mar 2, 2017
- INFINEON TECHNOLOGIES AG
- Charles Rimbert-Riviere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Charles Rimbert-Riviere

Person

Patents Grantslast 30 patents

Transport system

Molded package with chip carrier comprising brazed electrically con...

Selecting a substrate to be soldered to a carrier

Molded package with chip carrier comprising brazed electrically con...

Patents Applicationslast 30 patents

SUBSTRATE BARCODE READABILITY ENHANCEMENT STRUCTURES AND METHOD

SUBSTRATE

Semiconductor Power Module with Crack Sensing

METHOD FOR SEPARATING SUBSTRATES

METHOD FOR FORMING A SEMICONDUCTOR SUBSTRATE ARRANGEMENT

Transport System

Molded package with chip carrier comprising brazed electrically con...

Method for Soldering an Insulating Substrate onto a Carrier