Charles T. Eytcheson

Person

Macy, IN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heatsink buffer configuration
- Patent number 6,918,437
- Issue date Jul 19, 2005
- Delphi Technologies, Inc.
- Charles T. Eytcheson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting a circuit component and joint structure therefor
- Patent number 6,822,331
- Issue date Nov 23, 2004
- Delphi Technologies, Inc.
- Charles T. Eytcheson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate subassembly with alignment and stress relie...
- Patent number 6,127,727
- Issue date Oct 3, 2000
- Delco Electronics Corp.
- Charles Tyler Eytcheson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel dual switch module
- Patent number 6,054,765
- Issue date Apr 25, 2000
- Delco Electronics Corporation
- Charles Tyler Eytcheson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Durable substrate subassembly for transistor switch module
- Patent number 5,895,974
- Issue date Apr 20, 1999
- Delco Electronics Corp.
- Charles Tyler Eytcheson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power semiconductor switch module
- Patent number 5,563,447
- Issue date Oct 8, 1996
- Delco Electronics Corp.
- Donald E. Lake
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Substrate subassembly for a transistor switch module
- Patent number 5,539,254
- Issue date Jul 23, 1996
- Delco Electronics Corp.
- Charles T. Eytcheson
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Coplanar linear dual switch module
- Patent number 5,523,620
- Issue date Jun 4, 1996
- Delco Electronics Corporation
- Charles T. Eytcheson
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Coaxial switch module
- Patent number 5,519,253
- Issue date May 21, 1996
- Delco Electronics Corp.
- Donald E. Lake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron and laser beam welding apparatus
- Patent number 5,517,059
- Issue date May 14, 1996
- Delco Electronics Corp.
- Charles T. Eytcheson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate subassembly and method of making transistor switch module
- Patent number 5,492,842
- Issue date Feb 20, 1996
- Delco Electronics Corp.
- Charles T. Eytcheson
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Linear dual switch module
- Patent number 5,444,295
- Issue date Aug 22, 1995
- Delco Electronics Corp.
- Donald E. Lake
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method and apparatus for through hole substrate printing
- Patent number 5,322,565
- Issue date Jun 21, 1994
- Delco Electronics Corporation
- Joseph M. Zachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for through hole substrate printing
- Patent number 5,080,929
- Issue date Jan 14, 1992
- Delco Electronics Corporation
- Joseph M. Zachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection lead having individual spiral lead design
- Patent number 5,072,281
- Issue date Dec 10, 1991
- Delco Electronics Corporation
- Charles T. Eytcheson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for molded integrated circuit package
- Patent number 4,490,902
- Issue date Jan 1, 1985
- General Motors Corporation
- Charles T. Eytcheson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device assembly having a lead frame with interl...
- Patent number 4,215,360
- Issue date Jul 29, 1980
- General Motors Corporation
- Charles T. Eytcheson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of mounting a circuit component and joint structure therefor
- Publication number 20050093115
- Publication date May 5, 2005
- DELPHI TECHNOLOGIES, INC.
- Charles T. Eytcheson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Heatsink buffer configuration
- Publication number 20030178177
- Publication date Sep 25, 2003
- Charles T. Eytcheson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of mounting a circuit component and joint structure therefor
- Publication number 20020190388
- Publication date Dec 19, 2002
- Charles Tyler Eytcheson
- H01 - BASIC ELECTRIC ELEMENTS

Charles T. Eytcheson

Person

Patents Grantslast 30 patents

Heatsink buffer configuration

Method of mounting a circuit component and joint structure therefor

Semiconductor substrate subassembly with alignment and stress relie...

Parallel dual switch module

Durable substrate subassembly for transistor switch module

High power semiconductor switch module

Substrate subassembly for a transistor switch module

Coplanar linear dual switch module

Coaxial switch module

Electron and laser beam welding apparatus

Substrate subassembly and method of making transistor switch module

Linear dual switch module

Method and apparatus for through hole substrate printing

Method and apparatus for through hole substrate printing

Interconnection lead having individual spiral lead design

Lead frame for molded integrated circuit package

Power semiconductor device assembly having a lead frame with interl...

Patents Applicationslast 30 patents

Method of mounting a circuit component and joint structure therefor

Heatsink buffer configuration

Method of mounting a circuit component and joint structure therefor