Charles Wayne Singleton Jr.

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Separation method, computer storage medium, and separation system
- Patent number 10,008,419
- Issue date Jun 26, 2018
- Tokyo Electron Limited
- Shinji Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation method, separation apparatus, and separation system
- Patent number 9,956,755
- Issue date May 1, 2018
- Tokyo Electron Limited
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling device, peeling system and peeling method
- Patent number 9,919,509
- Issue date Mar 20, 2018
- Tokyo Electron Limited
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation apparatus, separation system, and separation method
- Patent number 9,827,756
- Issue date Nov 28, 2017
- Tokyo Electron Limited
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate conveyance apparatus and substrate peeling system
- Patent number 9,679,798
- Issue date Jun 13, 2017
- Tokyo Electron Limited
- Yasuharu Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a magnetically coupled thin-wafer handling system
- Patent number 9,003,642
- Issue date Apr 14, 2015
- Intel Corporation
- Jeffrey Wienrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetically coupled thin-wafer handling system
- Patent number 8,276,262
- Issue date Oct 2, 2012
- Intel Corporation
- Jeff Wienrich
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer backside grinding with stress relief
- Patent number 8,222,118
- Issue date Jul 17, 2012
- Intel Corporation
- Mark Dydyk
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MAGNETICALLY COUPLED THIN-WAFER HANDLING SYSTEM
- Publication number 20120321430
- Publication date Dec 20, 2012
- Jeff Wienrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Backside Grinding with Stress Relief
- Publication number 20100151678
- Publication date Jun 17, 2010
- Mark Dydyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETICALLY COUPLED THIN-WAFER HANDLING SYSTEM
- Publication number 20100135764
- Publication date Jun 3, 2010
- Jeff Wienrich
- H01 - BASIC ELECTRIC ELEMENTS

Charles Wayne Singleton Jr.

Person

Patents Grantslast 30 patents

Separation method, computer storage medium, and separation system

Separation method, separation apparatus, and separation system

Peeling device, peeling system and peeling method

Separation apparatus, separation system, and separation method

Substrate conveyance apparatus and substrate peeling system

Method for making a magnetically coupled thin-wafer handling system

Magnetically coupled thin-wafer handling system

Wafer backside grinding with stress relief

Patents Applicationslast 30 patents

MAGNETICALLY COUPLED THIN-WAFER HANDLING SYSTEM

Wafer Backside Grinding with Stress Relief

MAGNETICALLY COUPLED THIN-WAFER HANDLING SYSTEM