Charles W.C. Lin

Person

Yunghe, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of making wiring substrate for stackable semiconductor asse...
- Patent number 10,211,067
- Issue date Feb 19, 2019
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor package having metal pin within through hol...
- Patent number 7,656,031
- Issue date Feb 2, 2010
- Bridge Semiconductor Corporation
- Cheng-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT CONDUCTIVE WIRING BOARD AND SEMICONDUCTOR ASSEMBLY USING THE SAME
- Publication number 20190267307
- Publication date Aug 29, 2019
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING WIRING BOARD WITH DUAL ROUTING CIRCUITRIES INTEGRA...
- Publication number 20180261535
- Publication date Sep 13, 2018
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING THERMALLY ENHANCED WIRING BOARD HAVING ISOLATOR IN...
- Publication number 20180263146
- Publication date Sep 13, 2018
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat-sinking memory module device
- Publication number 20100214742
- Publication date Aug 26, 2010
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced Package with Embedded Metal Slug and Patterned C...
- Publication number 20090284932
- Publication date Nov 19, 2009
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGED LIGHT-EMITTING DEVICES
- Publication number 20090218588
- Publication date Sep 3, 2009
- Paul Panaccione
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor chip assembly with sacrificia...
- Publication number 20080188037
- Publication date Aug 7, 2008
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stackable semiconductor package having metal pin within through hol...
- Publication number 20080185708
- Publication date Aug 7, 2008
- Bridge Semiconductor Corporation
- Cheng-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Charles W.C. Lin

Person

Patents Grantslast 30 patents

Methods of making wiring substrate for stackable semiconductor asse...

Stackable semiconductor package having metal pin within through hol...

Patents Applicationslast 30 patents

HEAT CONDUCTIVE WIRING BOARD AND SEMICONDUCTOR ASSEMBLY USING THE SAME

METHOD OF MAKING WIRING BOARD WITH DUAL ROUTING CIRCUITRIES INTEGRA...

METHOD OF MAKING THERMALLY ENHANCED WIRING BOARD HAVING ISOLATOR IN...

Heat-sinking memory module device

Thermally Enhanced Package with Embedded Metal Slug and Patterned C...

CHIP-SCALE PACKAGED LIGHT-EMITTING DEVICES

Method of manufacturing semiconductor chip assembly with sacrificia...

Stackable semiconductor package having metal pin within through hol...