Charlie Han

Person

Hsinchu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packages and the method for making the same
- Patent number 6,846,697
- Issue date Jan 25, 2005
- United Microelectronics Corp.
- Kai-Kuang Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for determining failure rate and selecting best burn-in time
- Patent number 6,820,029
- Issue date Nov 16, 2004
- United Microelectronics Corp.
- Walx Fang
- G01 - MEASURING TESTING
Information Patent Grant
Method of fabricating an LC panel
- Patent number 6,669,520
- Issue date Dec 30, 2003
- United Microelectronics Corp.
- Chin-Lung Hung
- G02 - OPTICS
Information Patent Grant
Integrated circuit packages and the method for the same
- Patent number 6,545,350
- Issue date Apr 8, 2003
- United Microelectronics Corp.
- Kai-Kuang Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placement and routing for wafer scale memory
- Patent number 6,512,708
- Issue date Jan 28, 2003
- United Microelectronic Corporation
- Min-Chih Hsuan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming package
- Patent number 6,461,956
- Issue date Oct 8, 2002
- United Microelectronics Corp.
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad design
- Patent number 6,429,532
- Issue date Aug 6, 2002
- United Microelectronics Corp.
- Charlie Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-dies packaging structure and packaging method
- Patent number 6,399,421
- Issue date Jun 4, 2002
- United Microelectronics Corp.
- Charlie Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternate timing wafer burn-in method
- Patent number 6,388,460
- Issue date May 14, 2002
- United Microelectronics Corp.
- Walx Fang
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of fabricating direct contact through hole type
- Patent number 6,352,923
- Issue date Mar 5, 2002
- United Microelectronics Corp.
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct contact through hole type wafer structure
- Patent number 6,323,546
- Issue date Nov 27, 2001
- United Microelectronics Corp.
- Min Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-dies packaging structure and packaging method
- Patent number 6,313,527
- Issue date Nov 6, 2001
- United Microelectronics Corp.
- Charlie Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preburn-in dynamic random access memory module and preburn-in circu...
- Patent number 6,279,141
- Issue date Aug 21, 2001
- Min-Chih Hsuan
- G11 - INFORMATION STORAGE
Information Patent Grant
Direct contact through hole type wafer structure
- Patent number 6,252,300
- Issue date Jun 26, 2001
- United Microelectronics Corp.
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integrated circuit structure and method of manufacturin...
- Patent number 6,214,630
- Issue date Apr 10, 2001
- United Microelectronics Corp.
- Min-Chih Hsuan
- G01 - MEASURING TESTING
Information Patent Grant
Cascade-type chip module
- Patent number 6,166,444
- Issue date Dec 26, 2000
- United Microelectronics Corp.
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module package
- Patent number 6,133,629
- Issue date Oct 17, 2000
- United Microelectronics Corp.
- Charlie Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit for burn-in operation on a wafer of memory devices
- Patent number 5,995,428
- Issue date Nov 30, 1999
- United Microelectronics Corp.
- Pien Chien
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for burn-in operation on a wafer of memory devices
- Patent number 5,946,248
- Issue date Aug 31, 1999
- United Microelectronics, Corp.
- Pien Chien
- G11 - INFORMATION STORAGE
Information Patent Grant
Repairable memory module and method of repairing memory modules
- Patent number 5,875,136
- Issue date Feb 23, 1999
- United Microelectronics Corporation
- Min-Chih Hsuan
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Universal serial bus interface memory controller and associated memory
- Publication number 20040039851
- Publication date Feb 26, 2004
- Jerry Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Flash memory bridiging device, method and application system
- Publication number 20030206442
- Publication date Nov 6, 2003
- Jerry Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of fabricating an LC panel
- Publication number 20030054722
- Publication date Mar 20, 2003
- Chin-Lung Hung
- G02 - OPTICS
Information Patent Application
Backpanel structure of liquid crystal on silicon
- Publication number 20030048397
- Publication date Mar 13, 2003
- Chin-Lung Hung
- G02 - OPTICS
Information Patent Application
Integrated circuit packages and the method for the same
- Publication number 20020111008
- Publication date Aug 15, 2002
- United Microelectronics Corp.
- Kai-Kuang Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit packages and the method for the same
- Publication number 20020102833
- Publication date Aug 1, 2002
- Kai-Kuang Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for determining failure rate and selecting best burn-in time
- Publication number 20020082796
- Publication date Jun 27, 2002
- United Microelectronics Corp.
- Walx Fang
- G01 - MEASURING TESTING
Information Patent Application
Dual-dies packaging structure and packaging method
- Publication number 20010054761
- Publication date Dec 27, 2001
- Charlie Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct contact through hole type wafer structure
- Publication number 20010005046
- Publication date Jun 28, 2001
- Min Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS

Charlie Han

Person

Patents Grantslast 30 patents

Integrated circuit packages and the method for making the same

Method for determining failure rate and selecting best burn-in time

Method of fabricating an LC panel

Integrated circuit packages and the method for the same

Placement and routing for wafer scale memory

Method of forming package

Pad design

Dual-dies packaging structure and packaging method

Alternate timing wafer burn-in method

Method of fabricating direct contact through hole type

Direct contact through hole type wafer structure

Dual-dies packaging structure and packaging method

Preburn-in dynamic random access memory module and preburn-in circu...

Direct contact through hole type wafer structure

Wafer level integrated circuit structure and method of manufacturin...

Cascade-type chip module

Multi-chip module package

Circuit for burn-in operation on a wafer of memory devices

Method for burn-in operation on a wafer of memory devices

Repairable memory module and method of repairing memory modules

Patents Applicationslast 30 patents

Universal serial bus interface memory controller and associated memory

Flash memory bridiging device, method and application system

Method of fabricating an LC panel

Backpanel structure of liquid crystal on silicon

Integrated circuit packages and the method for the same

Integrated circuit packages and the method for the same

Method for determining failure rate and selecting best burn-in time

Dual-dies packaging structure and packaging method

Direct contact through hole type wafer structure