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Chau-Chun WEN

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  • Taoyuan, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    THREE-DIMENSIONAL PACKAGE STRUCTURE
    • Publication number 20200176429
    • Publication date Jun 4, 2020
    • CYNTEC CO., LTD.
    • Da-Jung Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THREE-DIMENSIONAL PACKAGE STRUCTURE
    • Publication number 20170133355
    • Publication date May 11, 2017
    • CYNTEC CO., LTD.
    • Da-Jung Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC PACKAGE STRUCTURE
    • Publication number 20130141886
    • Publication date Jun 6, 2013
    • CYNTEC CO., LTD.
    • Da-Jung Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THREE-DIMENSIONAL PACKAGE STRUCTURE
    • Publication number 20130001756
    • Publication date Jan 3, 2013
    • CYNTEC CO., LTD.
    • Da-Jung Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC PACKAGE STRUCTURE
    • Publication number 20120014079
    • Publication date Jan 19, 2012
    • CYNTEC CO. LTD.
    • Da-Jung CHEN
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    THREE-DIMENSIONAL PACKAGE STRUCTURE
    • Publication number 20110278704
    • Publication date Nov 17, 2011
    • Cyntec Co., Ltd.
    • Da-Jung CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC PACKAGE STRUCTURE
    • Publication number 20110090648
    • Publication date Apr 21, 2011
    • CYNTEC CO., LTD.
    • Da-Jung Chen
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    CHIP PACKAGE STRUCTURE
    • Publication number 20100117216
    • Publication date May 13, 2010
    • CYNTEC CO., LTD.
    • Bau-Ru Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE STRUCTURE
    • Publication number 20100059870
    • Publication date Mar 11, 2010
    • CYNTEC CO., LTD.
    • Chau-Chun Wen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC PACKAGE STRUCTURE
    • Publication number 20090207574
    • Publication date Aug 20, 2009
    • CYNTEC CO., LTD.
    • Da-Jung Chen
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    THREE-DIMENSIONAL PACKAGE STRUCTURE
    • Publication number 20080303125
    • Publication date Dec 11, 2008
    • DA-JUNG CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC PACKAGE STRUCTURE
    • Publication number 20080179722
    • Publication date Jul 31, 2008
    • CYNTEC CO., LTD.
    • Da-Jung Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC PACKAGE STRUCTURE
    • Publication number 20080180921
    • Publication date Jul 31, 2008
    • CYNTEC CO., LTD.
    • Da-Jung Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Package structure
    • Publication number 20070257377
    • Publication date Nov 8, 2007
    • Da-Jung Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Package device with electromagnetic interference shield
    • Publication number 20070096293
    • Publication date May 3, 2007
    • CYNTEC CO., LTD.
    • Chau Chun Wen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method for preventing the overflowing of molding compound during fa...
    • Publication number 20060284340
    • Publication date Dec 21, 2006
    • CYNTEC CO., LTD.
    • Chun-Tiao Liu
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    Power module package structure
    • Publication number 20060267187
    • Publication date Nov 30, 2006
    • CYNTEC CO., LTD.
    • Chun-Tiao Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Package structure having mixed circuit and composite substrate
    • Publication number 20060220188
    • Publication date Oct 5, 2006
    • CYNTEC CO., LTD.
    • Chun-Tiao Liu
    • H01 - BASIC ELECTRIC ELEMENTS