Chaug-Liang Hsu

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Taipei, TW

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Patents Grantslast 30 patents

Information Patent Grant
Compensating chemical mechanical wafer polishing apparatus and method
- Patent number 6,685,543
- Issue date Feb 3, 2004
- Chung Shan Institute of Science & Technology
- Jer-Shyong Lai
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Method of polishing semiconductor copper interconnect integrated wi...
- Publication number 20040259481
- Publication date Dec 23, 2004
- CHUNG SHAN INSTITUTE OF SCIENCE & TECHNOLOGY
- Wen-Chueh Pan
- B24 - GRINDING POLISHING
Information Patent Application
Compensating chemical mechanical wafer polishing apparatus and method
- Publication number 20030100196
- Publication date May 29, 2003
- CHUNG SHAN INSTITUTE OF SCIENCE & TECHNOLOGY
- Jer-Shyong Lai
- B24 - GRINDING POLISHING