Chaun-Yu Wu

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Hsinchu City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and method for making the same
- Patent number 9,159,660
- Issue date Oct 13, 2015
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for making the same
- Patent number 8,658,466
- Issue date Feb 25, 2014
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20140027905
- Publication date Jan 30, 2014
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20130334681
- Publication date Dec 19, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS