Chaung-Lin LAI

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package and method for forming a chip package having first and...
- Patent number 12,272,712
- Issue date Apr 8, 2025
- Xintec Inc.
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 12,237,354
- Issue date Feb 25, 2025
- Xintec Inc.
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,746,003
- Issue date Sep 5, 2023
- Xintec Inc.
- Tsang-Yu Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,319,208
- Issue date May 3, 2022
- Xintec Inc.
- Tsang-Yu Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 10,461,117
- Issue date Oct 29, 2019
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,997,473
- Issue date Jun 12, 2018
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20230369371
- Publication date Nov 16, 2023
- XINTEC INC.
- Tsang-Yu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230230933
- Publication date Jul 20, 2023
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20220285423
- Publication date Sep 8, 2022
- XINTEC INC.
- Tsang-Yu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220219970
- Publication date Jul 14, 2022
- XINTEC INC.
- Tsang-Yu LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210032096
- Publication date Feb 4, 2021
- XINTEC INC.
- Tsang-Yu LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20180175101
- Publication date Jun 21, 2018
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170256496
- Publication date Sep 7, 2017
- XINTEC INC.
- Chia-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170207182
- Publication date Jul 20, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF
- Publication number 20170098678
- Publication date Apr 6, 2017
- XINTEC INC.
- Chaung-Lin LAI
- H01 - BASIC ELECTRIC ELEMENTS

Chaung-Lin LAI

Person

Patents Grantslast 30 patents

Chip package and method for forming a chip package having first and...

Chip package and method for forming the same

Chip package

Chip package and manufacturing method thereof

Semiconductor structure and method for manufacturing semiconductor...

Chip package and method for forming the same

Patents Applicationslast 30 patents

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF