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Chaur-Chin Yang

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  • Tainan, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Flip-chip package
    • Patent number 7,473,989
    • Issue date Jan 6, 2009
    • Advanced Semiconductor Engineering, Inc.
    • Chaur-Chin Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stack type flip-chip package
    • Patent number 7,034,388
    • Issue date Apr 25, 2006
    • Advanced Semiconductor Engineering, Inc.
    • Chaur-Chin Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-chip stack flip-chip package
    • Patent number 6,861,761
    • Issue date Mar 1, 2005
    • Advanced Semiconductor Engineering Inc.
    • Chaur-Chin Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stack type flip-chip package
    • Patent number 6,768,190
    • Issue date Jul 27, 2004
    • Advanced Semiconductor Engineering, Inc.
    • Chaur-Chin Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Assembly package with stacked dies and signal transmission plate
    • Patent number 6,717,253
    • Issue date Apr 6, 2004
    • Advanced Semiconductor Engineering, Inc.
    • Chaur-chin Yang
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Flip chip on leadframe package and method for manufacturing the same
    • Publication number 20050287705
    • Publication date Dec 29, 2005
    • Advanced Semiconductor Engineering, Inc.
    • Chaur-Chin Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Flip-chip package
    • Publication number 20050046039
    • Publication date Mar 3, 2005
    • Advanced Semiconductor Engineering, Inc.
    • Chaur-Chin Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stack type flip-chip package
    • Publication number 20040251531
    • Publication date Dec 16, 2004
    • Chaur-Chin Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Thin type ball grid array package
    • Publication number 20040173903
    • Publication date Sep 9, 2004
    • ADVANCED SEMICONDUCTOR ENGINEERING INC.
    • Chaur-Chin Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Signal transmission plate used in an assembly package
    • Publication number 20040145035
    • Publication date Jul 29, 2004
    • Chaur-Chin Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-chip stack flip-chip package
    • Publication number 20040124539
    • Publication date Jul 1, 2004
    • Advanced Semiconductor Engineering, Inc.
    • Chaur-Chin Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stack type flip-chip package
    • Publication number 20030141582
    • Publication date Jul 31, 2003
    • Chaur-Chin Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked package
    • Publication number 20030141583
    • Publication date Jul 31, 2003
    • Chaur-Chin Yang
    • H01 - BASIC ELECTRIC ELEMENTS