CHE-CHUAN YANG

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package having dummy dies
- Patent number 12,266,635
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Chia Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,261,102
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding cage structure with respect to the receptacle connector w...
- Patent number 12,244,101
- Issue date Mar 4, 2025
- Molex, LLC
- Che-Yuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,237,276
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with multi-lid structures and method for...
- Patent number 12,170,238
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method
- Patent number 12,148,684
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device package having dummy...
- Patent number 12,125,822
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Chia Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with curved conductive lines and method of for...
- Patent number 12,100,664
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eccentric via structures for stress reduction
- Patent number 12,094,828
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,033,906
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with lid and method for forming the same
- Patent number 12,033,913
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite deep trench isolation structure in an image sensor
- Patent number 12,027,554
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with buffer structure and method for forming...
- Patent number 11,990,418
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of package containing chip structure...
- Patent number 11,978,722
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET structure with fin top hard mask and method of forming the same
- Patent number 11,923,457
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking via structures for stress reduction
- Patent number 11,855,008
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,855,004
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of package with underfill
- Patent number 11,784,130
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector assembly with movable heat sink
- Patent number 11,784,434
- Issue date Oct 10, 2023
- Molex, LLC
- Che-Yuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with curved conductive lines and method of for...
- Patent number 11,749,644
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector assembly
- Patent number 11,729,941
- Issue date Aug 15, 2023
- Molex, LLC
- Che-Yuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with ring structure and method for forming t...
- Patent number 11,728,233
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,721,643
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming semiconductor structures with semimetal features
- Patent number 11,715,770
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having warpage control and method of f...
- Patent number 11,699,668
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with multi-lid structures and method for...
- Patent number 11,694,941
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded connector assembly with improved thermal management
- Patent number 11,677,190
- Issue date Jun 13, 2023
- Molex, LLC
- Che-Yuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector assembly with metallic cage having elastic gro...
- Patent number 11,677,192
- Issue date Jun 13, 2023
- Molex, LLC
- Che-Yuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking via structures for stress reduction
- Patent number 11,670,601
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector assembly
- Patent number 11,653,474
- Issue date May 16, 2023
- Molex, LLC
- You-Qian Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Screen control system
- Publication number 20250097373
- Publication date Mar 20, 2025
- NOVATEK MICROELECTRONICS CORP.
- Chun-Tang Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH MULTI-LID STRUCTURES AND METHOD FOR...
- Publication number 20250069982
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD
- Publication number 20240387339
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE PLASMA EXCLUSION ZONE IN SEMICONDUCTOR FABRICATION
- Publication number 20240387148
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Che Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20240387335
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE HAVING DUMMY DIES
- Publication number 20240371829
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Chia Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CURVED CONDUCTIVE LINES AND METHOD OF FOR...
- Publication number 20240371783
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY
- Publication number 20240364056
- Publication date Oct 31, 2024
- Molex, LLC
- Che-Yuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ECCENTRIC VIA STRUCTURES FOR STRESS REDUCTION
- Publication number 20240363543
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH LID
- Publication number 20240347410
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MIM CAPACITOR HAVING A COMB STRUCTURE AND METHODS...
- Publication number 20240332163
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Che Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240312852
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE
- Publication number 20240304559
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY
- Publication number 20240297463
- Publication date Sep 5, 2024
- Molex, LLC
- Che-Yuan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE CONTAINING CHIP STRUCTURE WITH INCLINED SIDEWALLS
- Publication number 20240250069
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG FOR ASSEMBLING CONNECTOR ASSEMBLY
- Publication number 20240213732
- Publication date Jun 27, 2024
- Molex, LLC
- Ya-Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE...
- Publication number 20240162051
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY
- Publication number 20240154367
- Publication date May 9, 2024
- Molex, LLC
- Che-Yuan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET STRUCTURE WITH FIN TOP HARD MASK AND METHOD OF FORMING THE SAME
- Publication number 20240105850
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Che-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240096822
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240084455
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Wei YANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Stacking Via Structures for Stress Reduction
- Publication number 20240088061
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY
- Publication number 20240027709
- Publication date Jan 25, 2024
- Molex, LLC
- Che-Yuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH UNDERFILL
- Publication number 20240021529
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20230411227
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Nan. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY
- Publication number 20230411897
- Publication date Dec 21, 2023
- Molex, LLC
- Che-Yuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE PLASMA EXCLUSION ZONE IN SEMICONDUCTOR FABRICATION
- Publication number 20230369023
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Che Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369370
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE DEEP TRENCH ISOLATION STRUCTURE IN AN IMAGE SENSOR
- Publication number 20230369368
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Curved Conductive Lines and Method of For...
- Publication number 20230361080
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS

CHE-CHUAN YANG

Person

Patents Grantslast 30 patents

Semiconductor device package having dummy dies

Semiconductor package and method of forming the same

Shielding cage structure with respect to the receptacle connector w...

Package structure

Semiconductor die package with multi-lid structures and method for...

Package structure and method

Method of manufacturing a semiconductor device package having dummy...

Semiconductor device with curved conductive lines and method of for...

Eccentric via structures for stress reduction

Semiconductor package and manufacturing method thereof

Chip package structure with lid and method for forming the same

Composite deep trench isolation structure in an image sensor

Chip package structure with buffer structure and method for forming...

Structure and formation method of package containing chip structure...

FinFET structure with fin top hard mask and method of forming the same

Stacking via structures for stress reduction

Package structure

Structure and formation method of package with underfill

Connector assembly with movable heat sink

Semiconductor device with curved conductive lines and method of for...

Connector assembly

Chip package structure with ring structure and method for forming t...

Package structure

Forming semiconductor structures with semimetal features

Semiconductor device package having warpage control and method of f...

Semiconductor die package with multi-lid structures and method for...

Shielded connector assembly with improved thermal management

Electrical connector assembly with metallic cage having elastic gro...

Stacking via structures for stress reduction

Connector assembly

Patents Applicationslast 30 patents

Screen control system

SEMICONDUCTOR DIE PACKAGE WITH MULTI-LID STRUCTURES AND METHOD FOR...

PACKAGE STRUCTURE AND METHOD

TUNABLE PLASMA EXCLUSION ZONE IN SEMICONDUCTOR FABRICATION

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE HAVING DUMMY DIES

SEMICONDUCTOR DEVICE WITH CURVED CONDUCTIVE LINES AND METHOD OF FOR...

CONNECTOR ASSEMBLY

ECCENTRIC VIA STRUCTURES FOR STRESS REDUCTION

CHIP PACKAGE STRUCTURE WITH LID

THREE DIMENSIONAL MIM CAPACITOR HAVING A COMB STRUCTURE AND METHODS...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE

CONNECTOR ASSEMBLY

PACKAGE STRUCTURE CONTAINING CHIP STRUCTURE WITH INCLINED SIDEWALLS

JIG FOR ASSEMBLING CONNECTOR ASSEMBLY

COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE...

CONNECTOR ASSEMBLY

FINFET STRUCTURE WITH FIN TOP HARD MASK AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

Stacking Via Structures for Stress Reduction

CONNECTOR ASSEMBLY

PACKAGE STRUCTURE WITH UNDERFILL

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

CONNECTOR ASSEMBLY

TUNABLE PLASMA EXCLUSION ZONE IN SEMICONDUCTOR FABRICATION

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

COMPOSITE DEEP TRENCH ISOLATION STRUCTURE IN AN IMAGE SENSOR

Semiconductor Device with Curved Conductive Lines and Method of For...