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Che-Ping CHOU
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Hsinchu, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device
Patent number
11,908,759
Issue date
Feb 20, 2024
Mediatek Inc.
Nan-Cheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with layer structures, antenna layer and elec...
Patent number
11,837,552
Issue date
Dec 5, 2023
Mediatek Inc.
Wen-Sung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package assembly having a conductive electromagnetic...
Patent number
11,728,292
Issue date
Aug 15, 2023
Mediatek Inc.
Tzu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having discrete antenna device
Patent number
11,721,882
Issue date
Aug 8, 2023
Mediatek Inc.
Fu-Yi Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with layer structures, antenna layer and elec...
Patent number
11,373,957
Issue date
Jun 28, 2022
Mediatek Inc.
Wen-Sung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,244,913
Issue date
Feb 8, 2022
Mediatek Inc.
Ying-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package using flip-chip technology
Patent number
10,991,669
Issue date
Apr 27, 2021
Mediatek Inc.
Che-Ya Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having discrete antenna device
Patent number
10,847,869
Issue date
Nov 24, 2020
Mediatek Inc.
Fu-Yi Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
10,784,206
Issue date
Sep 22, 2020
Mediatek Inc.
Wen-Sung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method for forming the same
Patent number
10,636,773
Issue date
Apr 28, 2020
Mediatek Inc.
Che-Hung Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out package structure having stacked carrier substrates and met...
Patent number
10,515,887
Issue date
Dec 24, 2019
Mediatek Inc.
Shih-Yi Syu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package assembly with passive device
Patent number
10,497,678
Issue date
Dec 3, 2019
Mediatek Inc.
Che-Hung Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package assembly
Patent number
10,468,341
Issue date
Nov 5, 2019
Mediatek Inc.
Nai-Wei Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and wafer level package including such semicon...
Patent number
10,224,287
Issue date
Mar 5, 2019
Mediatek Inc.
Shih-Yi Syu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package assembly
Patent number
10,199,318
Issue date
Feb 5, 2019
Mediatek Inc.
Nai-Wei Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package assembly
Patent number
10,147,674
Issue date
Dec 4, 2018
Mediatek Inc.
Tung-Hsien Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out package structure
Patent number
10,128,192
Issue date
Nov 13, 2018
Mediatek Inc.
Min-Chen Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package incorporating redistribution layer interposer
Patent number
10,103,128
Issue date
Oct 16, 2018
Mediatek Inc.
Che-Ya Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System-in-package and fabrication method thereof
Patent number
10,074,628
Issue date
Sep 11, 2018
Mediatek Inc.
Hsing-Chih Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package assembly with passive device
Patent number
9,818,727
Issue date
Nov 14, 2017
Mediatek Inc.
Che-Hung Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and wafer level package including such semicon...
Patent number
9,704,808
Issue date
Jul 11, 2017
Mediatek Inc.
Shih-Yi Syu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package assembly
Patent number
9,704,792
Issue date
Jul 11, 2017
Mediatek Inc.
Tung-Hsien Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enhanced flip chip structure using copper column interconnect
Patent number
9,437,534
Issue date
Sep 6, 2016
Mediatek Inc.
Thomas Matthew Gregorich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out semiconductor package with copper pillar bumps
Patent number
9,165,877
Issue date
Oct 20, 2015
MediaTek Inc.
Nan-Cheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enhanced flip chip structure using copper column interconnect
Patent number
9,064,757
Issue date
Jun 23, 2015
MediaTek Inc.
Thomas Matthew Gregorich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure of package on package and method for fabricating the same
Patent number
7,550,836
Issue date
Jun 23, 2009
Advanced Semiconductor Engineering, Inc.
Che-Ya Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fuel cell module compatible with a dry cell
Patent number
7,485,387
Issue date
Feb 3, 2009
Yuan Ze Univeersity
Che-Ping Chou
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Grant
Packaging substrate and manufacturing method thereof
Patent number
7,445,944
Issue date
Nov 4, 2008
ASE (Shanghai) Inc.
Ho-Ming Tong
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH LAYER STRUCTURES, ANTENNA LAYER AND ELEC...
Publication number
20220352084
Publication date
Nov 3, 2022
MEDIATEK INC.
Wen-Sung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY
Publication number
20210202425
Publication date
Jul 1, 2021
MEDIATEK INC.
Che-Ya CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20210193540
Publication date
Jun 24, 2021
MEDIATEK INC.
Nan-Cheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
Publication number
20210036405
Publication date
Feb 4, 2021
MEDIATEK INC.
Fu-Yi Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20200402931
Publication date
Dec 24, 2020
MEDIATEK INC.
Ying-Chih CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20200381365
Publication date
Dec 3, 2020
MEDIATEK INC.
Wen-Sung HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY HAVING A CONDUCTIVE ELECTROMAGNETIC...
Publication number
20200168572
Publication date
May 28, 2020
MEDIATEK INC.
Tzu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE FOR HIGH-DATA RATE COMMUNICATION APPLICATIONS
Publication number
20190355697
Publication date
Nov 21, 2019
MEDIATEK INC.
Min-Chen Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
Publication number
20190131233
Publication date
May 2, 2019
MEDIATEK INC.
Nai-Wei LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20190051609
Publication date
Feb 14, 2019
MEDIATEK INC.
Wen-Sung HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
Publication number
20180358685
Publication date
Dec 13, 2018
MEDIATEK INC.
Fu-Yi Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20180102298
Publication date
Apr 12, 2018
MEDIATEK INC.
Nan-Cheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGE STRUCTURE HAVING STACKED CARRIER SUBSTRATES AND MET...
Publication number
20180082936
Publication date
Mar 22, 2018
MEDIATEK INC.
Shih-Yi SYU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-BUMPED REDISTRIBUTION LAYER STRUCTURE AND SEMICONDUCTOR PACKAGE...
Publication number
20180053665
Publication date
Feb 22, 2018
MEDIATEK INC.
Che-Hung Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY WITH PASSIVE DEVICE
Publication number
20180033774
Publication date
Feb 1, 2018
MEDIATEK INC.
Che-Hung KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGE STRUCTURE
Publication number
20180025985
Publication date
Jan 25, 2018
MEDIATEK INC.
Min-Chen LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
Publication number
20170338175
Publication date
Nov 23, 2017
MEDIATEK INC.
Nai-Wei LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
Publication number
20170271250
Publication date
Sep 21, 2017
MEDIATEK INC.
Tung-Hsien HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND WAFER LEVEL PACKAGE INCLUDING SUCH SEMICON...
Publication number
20170271265
Publication date
Sep 21, 2017
MEDIATEK INC.
Shih-Yi Syu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCORPORATING REDISTRIBUTION LAYER INTERPOSER
Publication number
20170243858
Publication date
Aug 24, 2017
MEDIATEK INC.
Che-Ya Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20170084589
Publication date
Mar 23, 2017
MEDIATEK INC.
Che-Hung KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGE STRUCTURE INCLUDING ANTENNA
Publication number
20170040266
Publication date
Feb 9, 2017
MEDIATEK INC.
Tzu-Hung LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY
Publication number
20160358877
Publication date
Dec 8, 2016
MEDIATEK INC.
Che-Ya CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING PAD ARRANGMENT DESIGN FOR SEMICONDUCTOR PACKAGE
Publication number
20160307873
Publication date
Oct 20, 2016
MEDIATEK INC.
Ying-Chih CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM-IN-PACKAGE AND FABRICATION METHOD THEREOF
Publication number
20160293575
Publication date
Oct 6, 2016
MEDIATEK INC.
Hsing-Chih Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND WAFER LEVEL PACKAGE INCLUDING SUCH SEMICON...
Publication number
20160276277
Publication date
Sep 22, 2016
MEDIATEK INC.
Shih-Yi Syu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY WITH PASSIVE DEVICE
Publication number
20160268233
Publication date
Sep 15, 2016
MEDIATEK INC.
Che-Hung KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
Publication number
20160260659
Publication date
Sep 8, 2016
MEDIATEK INC.
Tung-Hsien HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM-IN-PACKAGE
Publication number
20160005726
Publication date
Jan 7, 2016
MEDIATEK INC.
Nan-Cheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENHANCED FLIP CHIP STRUCTURE USING COPPER COLUMN INTERCONNECT
Publication number
20150249060
Publication date
Sep 3, 2015
MEDIATEK INC.
Thomas Matthew Gregorich
H01 - BASIC ELECTRIC ELEMENTS