Che-Wei Tien

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Interconnect structures and methods and apparatuses for forming the...
- Patent number 11,694,899
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsu Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Interconnect Structures and Methods and Apparatuses for Forming the...
- Publication number 20230317459
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chun-Hsu Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Interconnect Structures and Methods and Apparatuses for Forming the...
- Publication number 20220384255
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods and Apparatuses for Forming the...
- Publication number 20210217622
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsu Yang
- H01 - BASIC ELECTRIC ELEMENTS